AVS 60th International Symposium and Exhibition
    Thin Film Wednesday Sessions
       Session TF+VT-WeM

Paper TF+VT-WeM11
Low Stress Carbon Films as Gas Barrier Layers

Wednesday, October 30, 2013, 11:20 am, Room 104 A

Session: Thin Film Permeation Barriers and Encapsulation
Presenter: J. Rowley, Brigham Young University
Authors: J. Rowley, Brigham Young University
R.C. Davis, Brigham Young University
L. Pei, Brigham Young University
R.R. Vanfleet, Brigham Young University
S. Liddiard, MOXTEK Incorporated
M. Harker, MOXTEK Incorporated
J. Abbott, MOXTEK Incorporated
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A low stress, flexible hydrogenated sp2 carbon film(a-C:H) was developed using reactive sputtering of a graphite target in an ethylene/argon gas mixture. This resulted in a corrosion resistant layer. The carbon film was characterized by a series of techniques including Raman, EELS, AFM, XPS, and CHN analysis. An ethylene to argon gas ratio of 0.1 resulted in a film with 83.9% carbon, 5.0% hydrogen and 10.6% oxygen by weight fraction. This corresponds to a mole fraction of hydrogen to carbon of 4:6, a large hydrogen fraction. The films are dominantly sp2 as seen by Raman and EELS. Bulge testing determined a low elastic modulus and strength. The 4:6 a-C:H, 100 micron films showed a stress of 200 MPa(compressive) which is much lower than what has been reported previously for sputtered carbon films.