AVS 58th Annual International Symposium and Exhibition
    Plasma Science and Technology Division Tuesday Sessions

Session PS-TuM
Advanced BEOL / Interconnect Etching I

Tuesday, November 1, 2011, 8:00 am, Room 201
Moderator: Ajit Balakrishna, Applied Materials, Inc.


  Click here to Download program book for this session  
  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

8:00am PS-TuM1
Narrow Pitch Dual Damascene Patterning using EUV Lithography in Association with a Spin-On Trilayer Resist System
Frederic Lazzarino, V. Truffert, B. Vereecke, S. Demuynck, IMEC, Belgium
8:20am PS-TuM2
TiN Hard Mask Integration Line Wiggling Onset: Etching Time Dependence
Gerardo Delgadino, Lam Research Corp.
8:40am PS-TuM3 Invited Paper
Surface Reaction Control for BEOL Application
Masanaga Fukasawa, T. Tatsumi, Sony Corporation, Japan
9:20am PS-TuM5
Trench First Metal Hard Mask RIE for the 22 nm Node and Beyond
Yannick Feurprier, R. Gaylord, Y. Chiba, K. Kumar, D. Trickett, TEL Technology Center, America, LLC, Y. Mignot, ST Microelectronics, R. Srivastava, T. Kwon, R. Koshy, C. Labelle, GlobalFoundries, Y.J. Park, Samsung, E. Wormyo, S. Allen, IBM Research, E. Soda, Renesas Electronics, D. Horak, Y. Yin, J. Arnold, IBM Research, M. Ishikawa, H. Tomizawa, Toshiba America Electronic Components
9:40am PS-TuM6
Plasma Processing of Ti and TiN Metal Hardmasks for Dielectric Etch
Florian Weilnboeck, E. Bartis, S. Shachar, G.S. Oehrlein, University of Maryland, College Park, D. Farber, T. Lii, C. Lenox, Texas Instruments Incorporated
11:00am PS-TuM10
Superposition of High Negative DC Voltage in Capacitively Coupled Plasma
A. Ranjan, Andrew Metz, A. Lisi, Y. Chiba, W. Li, Y. Feurprier, K. Kumar, P. Biolsi, TEL Technology Center, America, LLC, L. Chen, P. Ventzek, R. Sundararajan, Tokyo Electron America
11:20am PS-TuM11
Evaluation of C5HF7: A High Etch Selectivity Hydrogen-Containing Fluorocarbon Gas for Oxide Etch
Robert Bruce, IBM T.J. Watson Research Center, M. Nakamura, ZEON Chemicals L.P., S. Engelmann, E.A. Joseph, IBM T.J. Watson Research Center, G. Matsuura, ZEON Chemicals L.P., N.C.M. Fuller, E.M. Sikorski, W.S. Graham, Y. Zhang, IBM T.J. Watson Research Center, A. Itou, Zeon Corporation
11:40am PS-TuM12
Etch Uniformity Improvement Using Mid-Gap Capacitively Coupled Plasma
Christopher Cole, A. Ko, A. Ranjan, T. Enomoto, A. Metz, K. Kumar, P. Biolsi, TEL Technology Center, America, LLC, E. Wornyo, H. Yusuff, S. Allen, R. Wise, IBM Research, C. Labelle, T. Chen, GlobalFoundries, S. Kanakasabapathy, IBM Research, Y. Mignot, STMicroelectronics