AVS 58th Annual International Symposium and Exhibition
    Plasma Science and Technology Division Thursday Sessions

Session PS-ThP
Plasma Science and Technology Poster Session

Thursday, November 3, 2011, 6:00 pm, Room East Exhibit Hall


  Click here to Download program book for this session  
  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

PS-ThP1
Anomalous Copper Contamination Observed during Hydrogen Plasma Processing
Andrey Zakharov, GlobalFoundries, Germany, P. Geissbuhler, C. Waldfried, Axcelis Technologies, R. Sonnemans, Axcelis Technologies, GmbH, Germany, I.L. Berry III, Axcelis Technologies
PS-ThP2
Real-Time Monitoring of Reactors Wall Status during Silicon and Metal Gate Etching
A.P. Marchelli, Guido Pietrogrande, MICRON Semiconductor Italia, Italy
PS-ThP3
Reaction Process of Si Surfaces with Hydrogen Plasma
Ko-jiro Hara, M. Shinohara, Y. Takami, Y. Takaki, Y. Matsuda, H. Fujiyama, Nagasaki University, Japan
PS-ThP4
Comparative Study on Atmospheric Pressure Plasma Modification on Packaging Material using Microwave and DBD Sources
Jungmi Hong, Y.L. Wu, T.S. Cho, D.N. Ruzic, University of Illinois at Urbana Champaign
PS-ThP6
Inductively Coupled Plasma-Enhanced Atomic Layer Deposition of Platinum Nano-particles and Platinum Thin Films Using Ar/O2 Plasma
Bo-Heng Liu, C.C. Kei, C.C. Yu, D.Y. Chiang, C.N. Hsiao, National Applied Research Laboratories, Taiwan, Republic of China
PS-ThP7
Properties and Performance of TiN, TiCN Coatings on Stainless Steel for Commercial Production Equipment
YuiLun Wu, J.M. Hong, T.S. Cho, D.N. Ruzic, University of Illinois at Urbana Champaign
PS-ThP8
The Dry Etching Properties of Na0.5K0.5NbO3 Thin Films in Inductively Coupled Plasma
Young-Hee Joo, J.C. Woo, C.I. Kim, Chung-Ang University, Republic of Korea
PS-ThP9
The Dry Etching Properties of IZO Thin Films in High Density CF4/Ar Plasma
Jong-Chang Woo, C.I. Kim, Chung-Ang University, Republic of Korea
PS-ThP10
The Dry Etching Properties of TaN Thin Film Using Inductively Coupled Plasma
J.C. Woo, Y.H. Joo, C. Li, Chang-Il Kim, Chung-Ang University, Republic of Korea
PS-ThP11
Mass Spectroscopy of Metastable Atomic Species in Gas Analysis and Processing Plasmas at High Spectrometer Source Pressures
D. Seymour, A.J. Rees, C. Greenwood, Sean Davies, M. Buckley, Hiden Analytical
PS-ThP12
Cutoff Probe Using Fourier Analysis for Electron Density Measurement
Byung-Keun Na, K.H. You, D.W. Kim, Korea Advanced Institute of Science and Technology, Republic of Korea, S.J. You, Korea Research Institute of Standards and Science, Republic of Korea, S.H. Seo, H.Y. Chang, Korea Advanced Institute of Science and Technology, Republic of Korea
PS-ThP13
Full Wave Simulation Study of Multi-mode Plasma Absorption Probes
Chuyu Kao, W.C. Chen, K.C. Leou, C.H. Hsieh, National Tsing Hua University, Taiwan, Republic of China
PS-ThP14
Characteristics of SiO2 Etching with Ar/C4F8/CHF3/O2 Gas Mixture in 60 MHz/2 MHz Dual Frequency Capacitive Coupled Plasmas
MinHwan Jeon, S.-K. Kang, J.Y. Park, G.Y. Yeom, Sungkyunkwan University, Republic of Korea
PS-ThP15
An Experimental Study on Large-Area Multi-Electrode Discharge for the Deposition of Microcrystalline Silicon Thin Film for Solar Cell
Yun-Seong Lee, S.H. Seo, H.Y. Chang, Korea Advanced Institute of Science and Technology, Republic of Korea
PS-ThP16
Qualitative Research on Low-Damage Neutral Beam Etching Effect of Mechanical Properties
Yuki Nishimori, U. Shinji, K. Tomohiro, BEANS Project, Japan, S. Masakazu, University of Tokyo and BEANS Project, Japan, G. Hashiguchi, Shizuoka University and BEANS Project, Japan
PS-ThP17
Free-standing Anodic Aluminum Oxide on Silicon Substrate by using Neutral Beam Etching
ChanKyu Kim, K.S. Min, J.S. Oh, G.Y. Yeom, Sungkyunkwan University, Republic of Korea
PS-ThP18
Synchronous Pulsed Inductively Coupled Plasma Source for Controllable Charged Process
KyungSeok Min, J.S. Oh, C.K. Kim, G.Y. Yeom, Sungkyunkwan University, Republic of Korea
PS-ThP19
Initial Studies of a-Si Deposition and Nano-Crystallization using a Novel Reactor with Rotating Substrates
Zhuo Chen, J.A. Mucha, V.M. Donnelly, D.J. Economou, University of Houston, Y. Lee, A.J. Akey, I.P. Herman, Columbia University
PS-ThP20
Fundamental Overview on a Controllable Optical Emission Spectroscopy Diagnostic System for Analysis of Process Chemistry
Gabriel Padron-Wells, P.L.S. Thamban, The University of Texas at Dallas, J. Hosch, Verity Instruments Incorporated, L.J. Overzet, M.J. Goeckner, The University of Texas at Dallas
PS-ThP22
Characterization of an ECR Etching Reactor using a Retarding Field Energy Analyzer
Borislav Dolinaj, D. Gahan, P. Scullin, D. O' Sullivan, MB. Hopkins, Impedans Ltd., Ireland, V. Milosavljevic, S. Daniels, NCPST Dublin City University, Ireland
PS-ThP23
Simulations of the Radial Line Slot Antenna Plasma Source
Peter Ventzek, Tokyo Electron America, S. Mahadevan, L. Raja, Esgee Technolgies, T. Iwao, Tokyo Electron Technology Development Institute, INC., L. Chen, M. Funk, B. Lane, R. Sundararajan, Tokyo Electron America, J. Yoshikawa, Tokyo Electron Technology Development Institute, INC., J. Zhao, Tokyo Electron America, T. Nozawa, C. Tian, K. Ishibashi, Tokyo Electron Technology Development Institute, INC.
PS-ThP24
Dual-Coil, Dual-Frequency ICP Source for Plasma Processing
Vladimir Nagorny, D. Lee, Mattson Technology, Inc.
PS-ThP25
Development of Inductively Coupled Hydrogen Plasma Source with a Ceramic Tube
Janghwee Cho, J. Yang, PSK Inc., Republic of Korea, S. Park, D. Lee, Inha University, Republic of Korea
PS-ThP26
Capability of Microwave Plasma Source for 450 mm Etching Apparatus
Shinji Obama, M. Izawa, H. Tamura, Hitachi High-Technologies Corp., Japan, K. Maeda, Hitachi Ltd., Japan
PS-ThP27
Plasma-based Techniques for Doping Three-Dimensional Structures
George Papasouliotis, K. Han, H. Persing, L. Godet, Varian Semiconductor Equipment Associates, Inc.
PS-ThP28
Study of Low-k Dielectric Damage in a Radial Line Slot Antenna (RLSA) Reactor
Yoshio Susa, Tokyo Electron Technology Development Institute, INC., R. Sundararajan, J. Zhao, L. Chen, Tokyo Electron US Holdings Ltd., T. Nozawa, Tokyo Electron Technology Development Institute, INC., J.A. Mucha, D.J. Economou, V.M. Donnelly, University of Houston, R. Wise, IBM Research
PS-ThP29
New Pulsed Plasma Generator for producing near Arc Free Discharges for Reactive Magnetron Sputter Processes
Roman Chistyakov, B. Abraham, Zond Inc/ Zpulser, J.Y. Park, SEMICAT Inc