AVS 58th Annual International Symposium and Exhibition | |
Plasma Science and Technology Division | Thursday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
PS-ThP1 Anomalous Copper Contamination Observed during Hydrogen Plasma Processing Andrey Zakharov, GlobalFoundries, Germany, P. Geissbuhler, C. Waldfried, Axcelis Technologies, R. Sonnemans, Axcelis Technologies, GmbH, Germany, I.L. Berry III, Axcelis Technologies |
PS-ThP2 Real-Time Monitoring of Reactors Wall Status during Silicon and Metal Gate Etching A.P. Marchelli, Guido Pietrogrande, MICRON Semiconductor Italia, Italy |
PS-ThP3 Reaction Process of Si Surfaces with Hydrogen Plasma Ko-jiro Hara, M. Shinohara, Y. Takami, Y. Takaki, Y. Matsuda, H. Fujiyama, Nagasaki University, Japan |
PS-ThP4 Comparative Study on Atmospheric Pressure Plasma Modification on Packaging Material using Microwave and DBD Sources Jungmi Hong, Y.L. Wu, T.S. Cho, D.N. Ruzic, University of Illinois at Urbana Champaign |
PS-ThP6 Inductively Coupled Plasma-Enhanced Atomic Layer Deposition of Platinum Nano-particles and Platinum Thin Films Using Ar/O2 Plasma Bo-Heng Liu, C.C. Kei, C.C. Yu, D.Y. Chiang, C.N. Hsiao, National Applied Research Laboratories, Taiwan, Republic of China |
PS-ThP7 Properties and Performance of TiN, TiCN Coatings on Stainless Steel for Commercial Production Equipment YuiLun Wu, J.M. Hong, T.S. Cho, D.N. Ruzic, University of Illinois at Urbana Champaign |
PS-ThP8 The Dry Etching Properties of Na0.5K0.5NbO3 Thin Films in Inductively Coupled Plasma Young-Hee Joo, J.C. Woo, C.I. Kim, Chung-Ang University, Republic of Korea |
PS-ThP9 The Dry Etching Properties of IZO Thin Films in High Density CF4/Ar Plasma Jong-Chang Woo, C.I. Kim, Chung-Ang University, Republic of Korea |
PS-ThP10 The Dry Etching Properties of TaN Thin Film Using Inductively Coupled Plasma J.C. Woo, Y.H. Joo, C. Li, Chang-Il Kim, Chung-Ang University, Republic of Korea |
PS-ThP11 Mass Spectroscopy of Metastable Atomic Species in Gas Analysis and Processing Plasmas at High Spectrometer Source Pressures D. Seymour, A.J. Rees, C. Greenwood, Sean Davies, M. Buckley, Hiden Analytical |
PS-ThP12 Cutoff Probe Using Fourier Analysis for Electron Density Measurement Byung-Keun Na, K.H. You, D.W. Kim, Korea Advanced Institute of Science and Technology, Republic of Korea, S.J. You, Korea Research Institute of Standards and Science, Republic of Korea, S.H. Seo, H.Y. Chang, Korea Advanced Institute of Science and Technology, Republic of Korea |
PS-ThP13 Full Wave Simulation Study of Multi-mode Plasma Absorption Probes Chuyu Kao, W.C. Chen, K.C. Leou, C.H. Hsieh, National Tsing Hua University, Taiwan, Republic of China |
PS-ThP14 Characteristics of SiO2 Etching with Ar/C4F8/CHF3/O2 Gas Mixture in 60 MHz/2 MHz Dual Frequency Capacitive Coupled Plasmas MinHwan Jeon, S.-K. Kang, J.Y. Park, G.Y. Yeom, Sungkyunkwan University, Republic of Korea |
PS-ThP15 An Experimental Study on Large-Area Multi-Electrode Discharge for the Deposition of Microcrystalline Silicon Thin Film for Solar Cell Yun-Seong Lee, S.H. Seo, H.Y. Chang, Korea Advanced Institute of Science and Technology, Republic of Korea |
PS-ThP16 Qualitative Research on Low-Damage Neutral Beam Etching Effect of Mechanical Properties Yuki Nishimori, U. Shinji, K. Tomohiro, BEANS Project, Japan, S. Masakazu, University of Tokyo and BEANS Project, Japan, G. Hashiguchi, Shizuoka University and BEANS Project, Japan |
PS-ThP17 Free-standing Anodic Aluminum Oxide on Silicon Substrate by using Neutral Beam Etching ChanKyu Kim, K.S. Min, J.S. Oh, G.Y. Yeom, Sungkyunkwan University, Republic of Korea |
PS-ThP18 Synchronous Pulsed Inductively Coupled Plasma Source for Controllable Charged Process KyungSeok Min, J.S. Oh, C.K. Kim, G.Y. Yeom, Sungkyunkwan University, Republic of Korea |
PS-ThP19 Initial Studies of a-Si Deposition and Nano-Crystallization using a Novel Reactor with Rotating Substrates Zhuo Chen, J.A. Mucha, V.M. Donnelly, D.J. Economou, University of Houston, Y. Lee, A.J. Akey, I.P. Herman, Columbia University |
PS-ThP20 Fundamental Overview on a Controllable Optical Emission Spectroscopy Diagnostic System for Analysis of Process Chemistry Gabriel Padron-Wells, P.L.S. Thamban, The University of Texas at Dallas, J. Hosch, Verity Instruments Incorporated, L.J. Overzet, M.J. Goeckner, The University of Texas at Dallas |
PS-ThP22 Characterization of an ECR Etching Reactor using a Retarding Field Energy Analyzer Borislav Dolinaj, D. Gahan, P. Scullin, D. O' Sullivan, MB. Hopkins, Impedans Ltd., Ireland, V. Milosavljevic, S. Daniels, NCPST Dublin City University, Ireland |
PS-ThP23 Simulations of the Radial Line Slot Antenna Plasma Source Peter Ventzek, Tokyo Electron America, S. Mahadevan, L. Raja, Esgee Technolgies, T. Iwao, Tokyo Electron Technology Development Institute, INC., L. Chen, M. Funk, B. Lane, R. Sundararajan, Tokyo Electron America, J. Yoshikawa, Tokyo Electron Technology Development Institute, INC., J. Zhao, Tokyo Electron America, T. Nozawa, C. Tian, K. Ishibashi, Tokyo Electron Technology Development Institute, INC. |
PS-ThP24 Dual-Coil, Dual-Frequency ICP Source for Plasma Processing Vladimir Nagorny, D. Lee, Mattson Technology, Inc. |
PS-ThP25 Development of Inductively Coupled Hydrogen Plasma Source with a Ceramic Tube Janghwee Cho, J. Yang, PSK Inc., Republic of Korea, S. Park, D. Lee, Inha University, Republic of Korea |
PS-ThP26 Capability of Microwave Plasma Source for 450 mm Etching Apparatus Shinji Obama, M. Izawa, H. Tamura, Hitachi High-Technologies Corp., Japan, K. Maeda, Hitachi Ltd., Japan |
PS-ThP27 Plasma-based Techniques for Doping Three-Dimensional Structures George Papasouliotis, K. Han, H. Persing, L. Godet, Varian Semiconductor Equipment Associates, Inc. |
PS-ThP28 Study of Low-k Dielectric Damage in a Radial Line Slot Antenna (RLSA) Reactor Yoshio Susa, Tokyo Electron Technology Development Institute, INC., R. Sundararajan, J. Zhao, L. Chen, Tokyo Electron US Holdings Ltd., T. Nozawa, Tokyo Electron Technology Development Institute, INC., J.A. Mucha, D.J. Economou, V.M. Donnelly, University of Houston, R. Wise, IBM Research |
PS-ThP29 New Pulsed Plasma Generator for producing near Arc Free Discharges for Reactive Magnetron Sputter Processes Roman Chistyakov, B. Abraham, Zond Inc/ Zpulser, J.Y. Park, SEMICAT Inc |