AVS 56th International Symposium & Exhibition
    Plasma Science and Technology Tuesday Sessions

Session PS-TuP
Plasma Science and Technology Poster Session

Tuesday, November 10, 2009, 6:00 pm, Room Hall 3


  Click here to Download program book for this session  
  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

PS-TuP1
Extension of Aluminum Etch using a Carbon Mask for High Aspect Ratio 70nm Al Etch with a Chlorine Based Chemistry
G. Ding, B. Schwarz, C. Lee, Applied Materials, Inc
PS-TuP2
A Study on the Etching Characteristics of Magnetic Tunnel Junction Films for Spin Transfer Torque MRAM
M.S. Lee, KAIST, Republic of Korea, J.Y. Moon, S.H. Cho, J.K. Jung, S.K. Lee, H.S. Kim, S.K. Park, Hynix Semicon., Republic of Korea, W.J. Lee, KAIST, Republic of Korea
PS-TuP3
Interactions of Plasma with Dielectrics during Ultra Low-k Dual Damascene Etch
Y. Zhou, R. Patz, A. Darlak, K. Zhou, J. Pender, Applied Materials, Inc., C. Labelle, GLOBALFOUNDRIES, D. Horak, IBM Research
PS-TuP4
Highly Selective Etching of Silicon Nitride to CVD a-C in Dual-Frequency Capacitively Coupled CH2F2/H2 Plasmas
J.S. Kim, N.-E. Lee, Sungkyunkwan University, Korea
PS-TuP5
Infinitely High Selective Etching of ITO Binary Mask Structure for Extreme Ultraviolet Lithography (EUVL)
Y.R. Park, N.-E. Lee, Sungkyunkwan University, Korea
PS-TuP6
Improvement of Surface Roughness in SOI Wafer Fabrication using Cl2-based Neutral Beam Etching
TH. Min, J.K. Yeon, B.J. Park, S.K. Kang, W.S. Lim, G.Y. Yeom, Sungkyunkwan University, Korea
PS-TuP7
In-situ Evaluation of Ashing Plasma Damages on Porous SiOCH Films Due to Ions, Radicals, and Radiation
H. Yamamoto, K. Takeda, M. Sekine, M. Hori, Nagoya University, Japan, T. Kaminatsui, K. Yamamoto, H. Hayashi, I. Sakai, T. Ohiwa, Toshiba Corporation Semiconductor Company, Japan
PS-TuP9
Origin of Electrical Changes Occurring at Plasma Etching Endpoints
M.A. Sobolewski, D.L. Lahr, National Institute of Standards and Technology
PS-TuP10
Optimization of Precursor Injection in an Atmospheric Pressure Plasma Jet System
F.J.J. Peeters, Eindhoven University of Technology, The Netherlands, R. Dams, R. Rego, M. Dubreuil, D. Vangeneugden, Flemish Institute for Technological Research (VITO), Belgium, M. Creatore, M.C.M. van de Sanden, Eindhoven University of Technology, The Netherlands
PS-TuP11
Plasma Etching of SiO2 Using a Pin-To-Plate Dielectric Barrier Discharge in Atmospheric Pressure
J.S. Oh, J.B. Park, E.L. Gil, G.Y. Yeom, Sungkyunkwan University, Republic of Korea
PS-TuP12
Diagnostic Study of Microplasmas in Contact with Saline Solution
H.W. Chang, A.H. Hsieh, C.L. Chen, C.C. Hsu, National Taiwan University, Taiwan
PS-TuP13
Synthesis of Niobium Oxide Nanowires Using an Atmospheric Pressure Plasma Jet
Y. Lin, C.C. Hsu, National Taiwan University, Taiwan
PS-TuP14
Study of an Atmospheric Pressure, Pulsed Arc Plasma Jet: Downstream Characterization and its Application to Thin Film Deposition
Y.W. Hsu, Y.J. Yang, C.C. Hsu, National Taiwan University, Taiwan
PS-TuP15
Amorphous Silicon Etching Using Atmospheric-Pressure Dielectric Barrier Discharge (APDBD) Plasma
H.C. Kwon, G.H. Kim, Seoul National University, Korea, S.H. Lee, Korea Institute of Materials Science, Korea, T.H. Noh, National Fusion Research Institute, Korea, S.I. Choi, S.G. Kim, S.K. Lim, Samsung Electronics Co. Ltd, Korea
PS-TuP16
Poly(ethylene glycol) Films Deposited by Atmospheric Pressure Plasma Liquid Deposition and Atmospheric Pressure Plasma-Enhanced Chemical Vapour Deposition : Synthesis of Non-Fouling Surfaces
B. Nisol, Université Libre de Bruxelles, Belgium, C. Poleunis, P. Bertrand, Université Catholique de Louvain, Belgium, F. Reniers, Université Libre de Bruxelles, Belgium
PS-TuP17
High Refractive Index Polymeric Optical Coatings by Plasma Polymerization
L.D. Hyde, H.J. Griesser, Ian Wark Research Institute, Australia
PS-TuP18
HfSiON Growth from Hf Metal/SiO2/Si(100) Stack with Nitrogen VHF-ICP Exposure
R. Kage, T. Kitajima, T. Nakano, National Defense Academy, Japan, T. Makabe, Keio University, Japan
PS-TuP19
Plasma Characterization of an Unbalanced Magnetron Sputter Deposition System
K. Pollock, J. Hiltrop, J. Doyle, Macalester College
PS-TuP20
Deposition Profile of Carbon Films in Submicron Wide Trenches using H-assisted Plasma CVD
T. Nomura, J. Umetsu, Y. Korenaga, H. Matsuzaki, Kyushu University, Japan, K. Koga, M. Shiratani, Kyushu University, and JST, CREST, Japan, Y. Setsuhara, Osaka University, and JST, CREST, Japan, M. Sekine, M. Hori, Nagoya University, and JST, CREST, Japan
PS-TuP21
Carbon Particle Formation Due to Interaction between Graphite and Helicon Plasmas
M. Shiratani, S. Iwashita, H. Miyata, K. Koga, Kyushu University, Japan