| AVS 53rd International Symposium | |
| Applied Surface Science | Thursday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:00am | AS-ThM1 Deep Core X-ray Photoelectron and Auger Spectra: A Comparison of Different Methods for Interpretation L. Kövér, M. Novák, Institute of Nuclear Research of the Hungarian Academy of Sciences, S. Egri, University of Debrecen, Hungary, I. Cserny, Z. Berényi, J. Tóth, Institute of Nuclear Research of the Hungarian Academy of Sciences, W. Drube, Synchrotron DESY, Germany, F. Yubero, CSIC-U, Spain, S. Tougaard, University of Southern Denmark, W.S.M. Werner, Vienna University of Technology, Austria |
| 8:20am | AS-ThM2 Film Thickness Determination of Ultra Thin HfO@sub 2@ Dielectrics with Angle Resolved XPS W.S.M. Werner, W. Smekal, Vienna University of Technology, Austria, D.W. Moon, K.J. Kim, Korean Research Institute for Standards and Science, C.J. Powell, National Institute of Standards and Technology |
| 8:40am | AS-ThM3 Structure and Properties of Ultra-Thin SiO@sub 2@ Plasma Polymer Films at Polymer/Metal Interfaces T. Titz, K. Wapner, G. Grundmeier, Max-Planck-Institut fuer Eisenforschung, Germany |
| 9:00am | AS-ThM4 Interfacial Interactions of PEKK Polymer Coatings onto Oxide-free Phosphate Films on an Aluminum Surface A.L. Asunskis, P.M.A. Sherwood, Oklahoma State University |
| 9:20am | AS-ThM5 Invited Paper DualBeam and Electron Microscopy Characterization of Buried Interfaces L.A. Giannuzzi, FEI Company |
| 10:00am | AS-ThM7 Applications of ToF-SIMS Depth Profiling to Problems involving Buried Interfaces and Particulate K.G. Lloyd, The DuPont Experimental Station |
| 10:20am | AS-ThM8 Vacuum Splitting at Buried Electronic Interfaces: A Technique Enabling Nanoscale Chemical and Physical Analysis W.F. Stickle, Hewlett-Packard Company, D. Ohlberg, J.J. Blackstock, C.L. Donley, D.R. Stewart, Hewlett Packard Labs |
| 10:40am | AS-ThM9 SIMS Measurements of C contamination in SOI M.H. Yang, L. Wang, L. Li, Evans Analytical Group |