AVS 53rd International Symposium
    Applied Surface Science Thursday Sessions
       Session AS-ThM

Invited Paper AS-ThM5
DualBeam and Electron Microscopy Characterization of Buried Interfaces

Thursday, November 16, 2006, 9:20 am, Room 2005

Session: Ultra Thin Films and Buried Interfaces
Presenter: L.A. Giannuzzi, FEI Company
Correspondent: Click to Email

A DualBeam instrument is a focused ion beam (FIB) column and a scanning electron microscope (SEM) on the same platform. The synergistic combination of FIB and SEM enables both 2D and 3D characterization of buried interfaces where site specific precision and throughput may be critical. Interphase interfaces as well as internal interfaces (i.e., grain boundaries) often govern material behavior and properties. Direct DualBeam characterization as well as DualBeam specimen preparation for subsequent transmission electron microscopy (TEM) or scanning TEM (STEM) is often the only way to characterize, monitor, or study the failure analysis mechanisms of buried interfaces, especially where nanometer scale devices or material multi-layers exist. Examples of techniques, methods, and applications of DualBeam characterization and specimen preparation of buried interphase interfaces and grain boundaries will be presented.