AVS 53rd International Symposium
    Plasma Science and Technology Monday Sessions
       Session PS-MoA

Invited Paper PS-MoA1
Core Technologies for The Transition from Si Technology to Nano-technology

Monday, November 13, 2006, 2:00 pm, Room 2009

Session: Manufacturing and Scientific Challenges for Plasma Processing at 32 nm
Presenter: H. Watanabe, Semiconductor Leading Edge Technologies, Inc. (Selete), Japan
Correspondent: Click to Email
Selete grapples with development of hp45/32nm module technology based on the results of Selete and MIRAI until now with promoting the variety project to meet widely the request which diversify. We take part in a new national project (MIRAI3) to develop the leading edge technologies of EUV lithography, post Cu interconnect, and robust transistor, and demonstrate the presence of Selete by worldwide preceding. In this presentation, I will introduce the challenge of Selete for 32nm module technologies and also discuss core technologies for the transisition from Si technology to Nano-technologies.