| AVS 52nd International Symposium | |
| MEMS and NEMS | Tuesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:20am | MN-TuM1 Invited Paper Nanomanufacturing Using Nanotemplates for Directed Assembly of Nanoelements A. Busnaina, Northeastern University, J. Mead, University of Massachusetts Lowell, G. Miller, University of New Hampshire, C. Barry, University of Massachusetts Lowell |
| 9:00am | MN-TuM3 Ion Trapping in Microfabricated Ion Trap Arrays D. Cruz, UCLA and Sandia National Laboratories, M. Fico, A.J. Guymon, R.G. Cooks, Purdue University, J.P. Chang, University of California, Los Angeles, M.G. Blain, Sandia National Laboratories |
| 9:20am | MN-TuM4 Monolithic In-Plane Tunable Optical Filter J. McGee, N. Siwak, R. Ghodssi, University of Maryland, College Park |
| 9:40am | MN-TuM5 Invited Paper Cooper-Pair Molasses - Cooling a Nanomechanical Resonator with the Quantum Noise of a Single Electron Transistor K.C. Schwab, National Security Agency |
| 10:20am | MN-TuM7 Granular Adsorbent Loading and Wafer Bonding for Si Microcavity Preconcentrator H.K. Chan, University of Michigan, M. Takei, Fuji Electric Systems, S.W. Pang, University of Michigan |
| 10:40am | MN-TuM8 Copper Electroplating to Fill Blind Vias for 3D Integration S. Spiesshoefer, S. Polamreddy, R. Figueroa, J. Patel, T. Lam, L. Cai, S. Burkett, L. Schaper, University of Arkansas |
| 11:00am | MN-TuM9 A Fully Integrated Micro Plasma Electron Source in Silicon E. Wapelhorst, J.P. Hauschild, J. Müller, Hamburg University of Technology, Germany |
| 11:20am | MN-TuM10 Deep Reactive Ion Etching of Membrane-Based Devices Using a Low-Frequency Bias R.J. Shul, J. Stevens, R.P. Manginell, M.G. Blain, S.G. Rich, S.A. Zmuda, L.J. Sanchez, Sandia National Laboratories, M. DeVre, J. Shin, S.L. Lai, Unaxis USA Inc. |
| 11:40am | MN-TuM11 Aspect Ratio Dependent Etching Lag Reduction in Deep Silicon Etch Processes S.L. Lai, D. Johnson, R.J. Westerman, Unaxis USA, Inc. |