| AVS 51st International Symposium | |
| Manufacturing Science and Technology | Thursday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:40am | MS-ThM2 Fault Detection and Classification Using RGA in Semiconductor Manufacturing Y. Xu, J. Byrne, H. Clark, J. Parker, IBM, J. Blessing, MKS |
| 9:00am | MS-ThM3 Invited Paper Using Process Control to Address Manufacturing Challenges at 300mm T.J. Sonderman, C. Bode, AMD |
| 9:40am | MS-ThM5 Run-to-Run Process Control And Equipment Monitoring for Advanced Etch Applications. J. Yamartino, D. Mui, H. Sasano, W. Liu, M. Shen, J.P. Holland, V. Todorow, A.M. Paterson, Applied Materials, Inc. |
| 10:00am | MS-ThM6 Gate Sidewall Profile Control for Plasma Etch Tool J. Tanaka, Hitachi Ltd., Japan, A. Kagoshima, D. Shiraishi, H. Yamamoto, S. Ikuhara, M. Yoshigai, Hitachi High Technologies Corporation, Japan |
| 10:20am | MS-ThM7 DRAM Gate CD Control in Dry Etch Process using Optical Integrated Metrology Y.J. Jung, Y.J. Kim, G.J. Min, C.J. Kang, H.K. Cho, J.-T. Moon, Samsung Electronics Co., LTD., Korea, J.W. Shon, Lam Research Corporation |
| 10:40am | MS-ThM8 Improving Etch Process Control with Advances in Vacuum Measurement J. Sipka, S. Pewsey, D. Leet, Mykrolis Corporation |
| 11:00am | MS-ThM9 New Intelligent Molecular Flow Sensor-Experimental Definition of Flow Properties H.S. Sagi, ATC, Inc. |