| AVS 50th International Symposium | |
| Manufacturing Science and Technology | Wednesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:20am | MS-WeM1 Critical Dimension and Remaining Film Thickness Within Wafer Uniformity Improvement by Advanced Process Control Based on Optical Integrated Metrology J. Luque, G.P. Kota, V. Vahedi, Lam Research Corporation |
| 8:40am | MS-WeM2 Real-time In-situ Chemical Sensing in GaN MOCVD for Advanced Process Control S. Cho, G.W. Rubloff, University of Maryland, M.E. Aumer, D.B. Thomson, D.P. Partlow, Northrop Grumman Corporation |
| 9:00am | MS-WeM3 Invited Paper Flexible Simulation Tools for Design, Control, and Optimzation of Semiconductor Processing Systems R.A. Adomaitis, University of Maryland |
| 9:40am | MS-WeM5 Invited Paper Spatial Uniformity as a Key Challenge in Semiconductor Process Control D.S. Boning, Massachusetts Institute of Technology |
| 10:20am | MS-WeM7 In-situ Defect Metrics Based on Real-Time Sensor Integration and Analysis J.A. Mucha, INFICON, Inc. |
| 10:40am | MS-WeM8 Prototype Development of Four-Point Probe with 100 µm Probe-Spacing for Resistivity Measurements M. Suzuki, Y. Sato, T. Ogiwara, NTT-AT, Japan, S. Kiyota, K. Watanabe, Kiyota Manufacturing Co., Japan, N. Matsubayashi, AIST, Japan, S. Matsumoto, Keio University, Japan |