IUVSTA 15th International Vacuum Congress (IVC-15), AVS 48th International Symposium (AVS-48), 11th International Conference on Solid Surfaces (ICSS-11), Session PS+MS-ThM

IUVSTA 15th International Vacuum Congress (IVC-15), AVS 48th International Symposium (AVS-48), 11th International Conference on Solid Surfaces (ICSS-11)
Plasma Science	Thursday Sessions

Session PS+MS-ThM
Conductor Etch and Damage

Thursday, November 1, 2001, 8:20 am, Room 104
Moderator: A.E. Wendt, University of Wisconsin, Madison

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in Adobe Acrobat format

Click a paper to see the details. Presenters are shown in bold type.

8:20am	PS+MS-ThM1 An Advanced 300 mm Etcher with Tunable Plasma Source for the Etching of <0.15mm Poly-Silicon Gates J. Holland, M. Jain, M. Shen, N. Gani, A.M. Paterson, V. Todorov, M.S. Barnes, K. Fairbairn, Applied Materials, Inc.
8:40am	PS+MS-ThM2 Plasma-Based Copper Etch Process - Additive Gas Effects S. Lee, Y. Kuo, Texas A&M University
9:00am	PS+MS-ThM3 Invited Paper Silicon Gate Etching: Potential Strategies for Future CMOS Devices G. Cunge, L. Vallier, O. Joubert, J. Foucher, X. Detter, CNRS/LTM, France
9:40am	PS+MS-ThM5 Sidewall Passivation Mechanism of CF@sub4@ Added Polysilicon Gate Etch Process T. Lill, F. Ameri, S. Deshmukh, D. Podlesnik, Applied Materials, L. Vallier, O. Joubert, CNRS/LTM, France
10:00am	PS+MS-ThM6 Manufacturing Viability of the "Notched Gate" Process for sub 0.1µm Technologies J. Foucher, L. Vallier, G. Cunge, O. Joubert, CNRS/LTM, France, T. Lill, Applied Materials
10:20am	PS+MS-ThM7 Properties of Pulsed ICPs with rf Substrate Biases@footnote 1@ P. Subramonium, M.J. Kushner, University of Illinois
10:40am	PS+MS-ThM8 Magnetic Field Effects and Electron Shading Damage W.W. Dostalik, Texas Instruments, Inc.
11:00am	PS+MS-ThM9 Effects of H@sub 2@, D@sub 2@, N@sub 2@ and Ar Plasma on III-V Compound Semiconductor Devices B. Luo, University of Florida, K. Ip, Agere Systems, F. Ren, K.P. Lee, S.J. Pearton, C.R. Abernathy, University of Florida, R.J. Shul, Sandia National Laboratories, S.N.G. Chu, Agere Systems, C.W. Tu, University of California, San Diego, C.S. Wu, Win Semiconductor, K.D. Mackenzie, Unaxis USA Inc., C.H. Hsu, Feng Chia University, Taiwan
11:40am	PS+MS-ThM11 Plasma Induced Physical Damage and Contamination on the SrBi@sub 2@Ta@sub 2@O@sub 9@ Thin Film after Etching in Cl@sub 2@/CF@sub 4@/Ar Plasma D.P. Kim, C.I. Kim, Chung-Ang University, Korea, W.J. Lee, B.G. Yu, ETRI, Korea