AVS 47th International Symposium | |
Manufacturing Science and Technology | Thursday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
8:20am | MS-ThM1 Simulation of Transient Enhanced Diffusion of B in Si G.S. Hwang, W.A. Goddard III, California Institute of Technology |
8:40am | MS-ThM2 New Physics for Models of Transient Enhanced Diffusion M.Y.L. Jung, E.G. Seebauer, University of Illinois, Urbana-Champaign |
9:00am | MS-ThM3 Fast-Ramp Annealing for Reducing Implant-Induced Transient Enhanced Diffusion M.Y.L. Jung, R. Gunawan, R.D. Braatz, E.G. Seebauer, University of Illinois, Urbana-Champaign |
9:20am | MS-ThM4 Invited Paper Dynamic Simulation: Guiding Manufacturing from Process Mechanisms to Factory Operations G.W. Rubloff, University of Maryland |
10:00am | MS-ThM6 Invited Paper Integrated Metrology with Run to Run Control P.R. Solomon, P.A. Rosenthal, S. Bosch-Charpenay, J. Xu, W. Zhang, On-Line Technologies, Inc. |
10:40am | MS-ThM8 W CVD Thickness Metrology and Run-to-Run Control using Mass Spectrometry Y. Xu, T. Gougousi, R. Sreenivasan, G.W. Rubloff, J.N. Kidder, E. Zafiriou, University of Maryland |
11:00am | MS-ThM9 Feedback Control of Morphology During III-V Semiconductor Growth by Molecular Beam Epitaxy@footnote 1@ R.L. Kosut, J.L. Ebert, S. Ghosal, SC Solutions, R. Caflisch, University of California, Los Angeles, M. Gyure, J.J. Zinck, HRL Laboratories |
11:20am | MS-ThM10 Invited Paper Data Requirements and Communication Issues for Advanced Process Control R.J.M. Markle, E.C.J. Coss, Jr, AMD |