AVS 47th International Symposium
    Manufacturing Science and Technology Thursday Sessions
       Session MS-ThM

Invited Paper MS-ThM10
Data Requirements and Communication Issues for Advanced Process Control

Thursday, October 5, 2000, 11:20 am, Room 304

Session: Advanced Modeling and Control for IC Manufacturing
Presenter: R.J.M. Markle, AMD
Authors: R.J.M. Markle, AMD
E.C.J. Coss, Jr, AMD
Correspondent: Click to Email
Data streams and communication issues are the most critical areas for successful Advanced Process Control (APC) programs. These areas are vital for both APC run-to-run controllers and Fault Detection and Classification (FDC) systems used for high volume manufacturing applications in the semiconductor industry. All APC systems rely on data streams to make their process changes, to keep the process on target and in control, and to otherwise signal a need for engineering involvement to make similar corrective actions. The access to, communication of, and reliability and integrity of these data streams are essential to all APC programs. APC run-to-run controllers use the data to make changes in the process. FDC systems focus on predicting pending equipment- or process- related problems or detecting them quickly when they occur. The inability to access the needed data stream can prohibit the use of APC run-to-run controllers or FDC systems on critical process operations. Worse yet, the use of unreliable or corrupted data can cause undesirable consequences. In order to better capitalize on the improvements demonstrated with APC run-to-run controllers and FDC systems, end users have often had to create their own communication and data processing methods. The first decade of the 21st century will place increased demands on process and metrology equipment manufacturers, APC software and hardware suppliers, and APC programmers. Improvements in these areas through the use of industry standards and best known methods could greatly accelerate the APC field. Wafer-to-wafer and within wafer process control could be essential for 300 millimeter wafer and large flat panel processing will need these improvements. We will discuss examples that Advanced Micro Devices (AMD) experienced in Fab25 within the past year. The case studies relate to complex but necessary methods to get the data we need for a FDC system and the role of metrology data on APC run-to-run controllers. Data and communication requirements for the next three to five years will also be discussed. The increased demands on current process and metrology systems will increase as we begin to use new and alternative technologies to support more advanced APC strategies.