| AVS 47th International Symposium | |
| Manufacturing Science and Technology | Friday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:20am | MS-FrM1 Invited Paper Surfaces, Interfaces, and Chemical Reactions in Semiconductor Technology and Manufacturing G.W. Rubloff, University of Maryland |
| 9:00am | MS-FrM3 The Application of In-situ Monitor of Extremely Rarefied Particle-clouds Grown Thermally Above Wafers by using Laser Light Scattering Method to the Development of the Mass-production Conditions of the Tungsten Thermal CVD N. Ito, T. Moriya, F. Uesugi, NEC Corporation, Japan, S. Moriya, M. Aomori, Y. Kato, Tokyo Electron Ltd., Japan, M. Tachibana, Tokyo Electron Yamanashi Ltd., Japan |
| 9:20am | MS-FrM4 Standard Practice for Temperature Calibration of the Silicon Substrate in Temperature Programmed Desorption Analysis T. Matsunaga, Matsushita Inc., N. Yabumoto, NTT Adv. Tech. Co., N. Hirashita, Oki Electric Ind. Co., Ltd., H. Okumura, Toray Res. Center, Inc., M. Nishiduka, Toshiba Corp., I. Nishiyama, NEC Corp., M. Matsuura, Mitsubishi Corp., M. Morita, Osaka Univ., A. Shimazaki, Toshiba Corp., T. Jimbo, Hitachi, Ltd., T. Ajioka, NTT Electronics Corp. |
| 9:40am | MS-FrM5 Standardization of the Method to a Disiloxane Concentration in Monosilane Gas using Atmospheric Pressure Ionization Mass Spectrometer M. Kitano, Tohoku Univ., Y. Sakakibara, NTT Adv. Tech. Corp., Y. Ishihara, Nippon Sanso Corp., Y. Kunii, Kokusai Electric Co., Ltd., K. Hasumi, Hitachi Tokyo Electronics Co., Ltd., I. Matsuda, Syowa Denko K.K., A. Ohki, Osaka Sanso Kogyo Ltd., Y. Shirai, Tohoku Univ. |
| 10:00am | MS-FrM6 A Wide Range Vacuum Sensor Fabricated by MEMS H. Miyashita, Y. Kitamura, H. Watanabe, ANELVA Corporation, Japan, M. Esashi, Tohoku University, Japan |
| 10:40am | MS-FrM8 The Effect of Molecular Weight of Organic Contaminants on their Adsorption on Si-wafers Y. Wakayama, Tohoku University, Japan, S. Kobayashi, T. Ishii, Taisei Corporation, Japan, S. Sugawa, T. Ohmi, Tohoku University, Japan |