AVS 47th International Symposium | |
MEMS | Wednesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
2:00pm | MM-WeA1 Surface Micromachining - Process Modeling C.C. Wong, P. Ho, Sandia National Laboratories, R.W. Walker, Los Alamos National Laboratory, R.P. Pawlowski, Sandia National Laboratories |
2:20pm | MM-WeA2 Application of Magnetic Neutral Loop Discharge Plasma in Deep Silica Etching W. Chen, K. Sugita, T. Hayashi, T. Uchida, ULVAC JAPAN, Ltd. |
2:40pm | MM-WeA3 Invited Paper Application of Deep Silicon Etching and Wafer Bonding in the MicroManufacturing of Turbochargers and Micro Gas Turbine Engines A.A. Ayon, J. Protz, R. Khanna, X. Zhang, A. Epstein, Massachusetts Institute of Technology |
3:20pm | MM-WeA5 MEMS Fabrication Technology Applied to Large Area X-ray Image-sensor Arrays J.H. Daniel, B. Krusor, R. Apte, R.A. Street, Xerox Palo Alto Research Center, A. Goredema, P. Kazmaier, Xerox Research Center Canada |
3:40pm | MM-WeA6 Switching of Interfacial Energies in Polymeric Coatings B.C. Bunker, J.G. Kushmerick, W.L. Smith, M.S. Kent, Sandia National Laboratories, G.P. Lopez, University of New Mexico, X.-Y. Zhu, University of Minnesota, D.L. Huber, T.D. Dunbar, Sandia National Laboratories |
4:00pm | MM-WeA7 A Novel Anti-Stiction Method Using the Harmonic Excitation on the Microstructure W.P. Lai, W. Fang, National Tsing Hua University, Taiwan |
4:20pm | MM-WeA8 Control of Residual Stress in Thick Sputtered Metal Films J.M. Melzak, D.A. Greer, Case Western Reserve University, S. Rajgopal, K.S. Lebouitz, XACTIX, Inc., M. Mehregany, Case Western Reserve University |
4:40pm | MM-WeA9 SiC Surface Micromachining Process Development and Device Characterization J.D. Scofield, B.N. Ganguly, Air Force Research Laboratory, A.J. Steckl, University of Cincinnati |
5:00pm | MM-WeA10 Micro- and Nanotube Fabrication using Deposited Porous Silicon W.J. Nam, S. Bae, A.K. Kalkan, S.J. Fonash, The Pennsylvania State University |