AVS 47th International Symposium
    Material Characterization Tuesday Sessions

Session MC-TuM
Real World Surface Analysis

Tuesday, October 3, 2000, 8:20 am, Room 207
Moderator: A. Belu, Physical Electronics


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  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

8:20am MC-TuM1
Surface Interaction, Coverage and Performance of Quaternary Amine Treatments on Hair
B.C. Beard, Akzo Nobel Chemicals, D. Tang, Akzo Nobel Surfactants America, J. Hare, Akzo Nobel Chemicals
8:40am MC-TuM2
Chemical Characterization of Modified Nanotips by TOF-SIMS and Laser-SNMS
R. Kamischke, F. Kollmer, Physikalisches Institut der Universitaet Muenster, Germany, R. Stark, W. Heckl, Institut fuer Kristallographie und Mineralogie der Universitaet Muenchen, Germany, A. Benninghoven, Physikalisches Institut der Universitaet Muenster, Germany
9:00am MC-TuM3 Invited Paper
Real World Surface Analysis
B. Hagenhoff, TASCON GmbH, Germany
9:40am MC-TuM5
Thermal Degradation of IM7/BMI5260 Composite Materials: Characterization by X-ray Photoelectron Spectroscopy
S. Ohno, M.-H. Lee, K.Y. Lin, F.S. Ohuchi, University of Washington
10:00am MC-TuM6
Pt-Metal Oxide Aerogel Catalysts: An X-ray Photoemission Investigation
A.J. Nelson, J.G. Reynolds, Lawrence Livermore National Laboratory
10:20am MC-TuM7
Quantification of the Changes in the Air-formed Oxide/Hydroxide Film at the Surface of Aluminium on Exposure to Ambient Conditions
M.R. Alexander, G.E. Thompson, UMIST, UK, G. Beamson, RUSTI, CLRC, UK, A.J. Roberts, Kratos Analytical, UK
10:40am MC-TuM8
Scanning Auger Microscopy Studies of an Ancient Bronze
E. Paparazzo, Consiglio Nazionale delle Ricerche, Italy, A.S. Lea, D.R. Baer, Pacific Northwest National Laboratory, J.P. Northover, University of Oxford, UK
11:00am MC-TuM9
Practical Applications of Surface Analysis Techniques in Electroplating
C. Xu, J.A. Abys, Lucent Technologies
11:20am MC-TuM10
Surface Chemistry and Physical Properties Related to Adhesion of Various Soldermask Materials
C.A. Bradbury, Y. Du, T. Jiang, Micron Technology Inc.