AVS 47th International Symposium
    Material Characterization Tuesday Sessions
       Session MC-TuM

Paper MC-TuM10
Surface Chemistry and Physical Properties Related to Adhesion of Various Soldermask Materials

Tuesday, October 3, 2000, 11:20 am, Room 207

Session: Real World Surface Analysis
Presenter: C.A. Bradbury, Micron Technology Inc.
Authors: C.A. Bradbury, Micron Technology Inc.
Y. Du, Micron Technology Inc.
T. Jiang, Micron Technology Inc.
Correspondent: Click to Email
In Flip Chip (FC) Ball Grid Array (BGA) packages, adhesion between soldermask material to mold compound, underfill and liquid encapsulant materials are critical to package reliability. Delamination will result in package crack and solder joint failure. In this study, the adhesion of several different types of soldermask materials to an underfill polymeric material was evaluated. The surface chemical properties of the soldermask materials were characterized using x-ray photoelectron spectroscopy (XPS) and surface tension test. The surface chemistry was correlated to the interfacial fracture toughness obtained by Mixed Mode Bending (MMB) test.