AVS 47th International Symposium
    Material Characterization Tuesday Sessions
       Session MC-TuM

Paper MC-TuM9
Practical Applications of Surface Analysis Techniques in Electroplating

Tuesday, October 3, 2000, 11:00 am, Room 207

Session: Real World Surface Analysis
Presenter: C. Xu, Lucent Technologies
Authors: C. Xu, Lucent Technologies
J.A. Abys, Lucent Technologies
Correspondent: Click to Email
Electroplating has been widely used to deposit thin metal films on various substrates either to achieve certain functionality (wear resistance, solderability, wire bondability, corrosion resistance) or specific appearance. The materials properties are critical to the functionality and are dependent on the electroplating process. These properties are determined by the elemental, and chemical composition, and deposit structure. Surface analysis techniques are unique in their ability to provide specific diagnostic tools to study electrodeposited films. In this paper, the potential of various surface analysis techniques for investigating failure modes and new products development in electroplating industries will be discussed and demonstrated using various case studies. A comparison of techniques such as AES and XPS to traditional failure mode analysis methods such as Scanning Electron Microscopy (SEM) will be made.