AVS 47th International Symposium | |
Material Characterization | Tuesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
2:00pm | MC-TuA1 Molecular Secondary Particle Emission from UHV-Prepared Molecular Overlayers A. Schnieders, M. Schröder, K. Rüschenschmidt, A. Benninghoven, H.F. Arlinghaus, Physikalisches Institut der Universität Münster, Germany |
2:20pm | MC-TuA2 Detection of Trace Metal Contamination on Si Wafers by TOF-SIMS R. Möllers, T. Grehl, E. Niehuis, ION-TOF GmbH, Germany |
2:40pm | MC-TuA3 Comparative Ion Yields by Secondary Ion Mass Spectrometry from Microelectronic Films C. Parks, IBM Corporation |
3:00pm | MC-TuA4 Invited Paper Quantitative Surface Analysis Using Ion Implantation F.A. Stevie, J.M. McKinley, C.N. Granger, Lucent Technologies, F. Hillion, CAMECA Instruments, D.S. Simons, P. Chi, National Institute of Standards and Technology, B. Schueler, Physical Electronics, C.B. Vartuli, T.L. Shofner, Lucent Technologies, L.A. Giannuzzi, University of Central Florida |
3:40pm | MC-TuA6 Comparison of ISS, XPS, and QUASES-XPS Techniques for Determination of Growth Mechanisms: Application to Thin Iron Oxide Films Deposited on SiO2 F. Yubero, A.R. Gonzalez-Elipe, Inst. for Material Science of Sevilla, S. Tougaard, University of Southern Denmark |
4:00pm | MC-TuA7 Quantitative Depth Profiling with Angle Resolved XPS: The Effect of Surface Roughness S.M. Hunt, Montana State University, B.J. Tyler, University of Utah |
4:20pm | MC-TuA8 Intercomparison of IMFPs Determined by Elastic Peak Electron Spectroscopy S. Tougaard, University of Southern Denmark, M. Krawczyk, A. Jablonski, Polish Academy of Sciences, J. Pavluch, Dept. Electronics and Vacuum Physics, Czech Rep., J. Toth, D. Varga, G. Gergerly, M. Menyhard, A. Sulyok, Hungarian Academy of Sciences |
4:40pm | MC-TuA9 Measurement of Silicon Dioxide Film Thicknesses by XPS C.J. Powell, National Institute of Standards and Technology, A. Jablonski, Polish Academy of Sciences |
5:00pm | MC-TuA10 A New Angle on Angle Dependent XPS K.S. Robinson, G. Jones, R. White, J. Wolstenholme, VG Scientific, UK |