AVS 47th International Symposium
    Plasma Science and Technology Wednesday Sessions
       Session PS-WeP

Paper PS-WeP32
New Reactor for High-rate Deposition of Functional Coatings on Polymer Substrates

Wednesday, October 4, 2000, 11:00 am, Room Exhibit Hall C & D

Session: Poster Session
Presenter: P. Bulkin, LPICM, Ecole Polytechnique, France
Authors: P. Bulkin, LPICM, Ecole Polytechnique, France
A. Hofrichter, LPICM, Ecole Polytechnique, France
B. Drevillon, LPICM, Ecole Polytechnique, France
Correspondent: Click to Email
Concept of Multi-Magnetron Electron Cyclotron Resonance (MMECR) reactor was developed for applications in high-rate low temperature deposition of SiO@sub 2@/SiO@sub X@/Si@sub 3@N@sub 4@ multilayer and gradient films onto large area polymer substrates, flat and bended. Whereas broadly used electron beam evaporation and magnetron spattering techniques well suited and extensively used for multiplayer coatings, CVD and PECVD in particular do have clear advantages for gradient films deposition. We present an efficient concept of plasma reactor and report on process parameters. Flexible coaxial cables deliver microwave power to 25 magnetron applicators wich contain rare-earth NdFeB permanent magnets. Gas injection arranged through two distribution grids, one for silane and one for other gases, respectively. In the current version the system provides uniformity of better than 2 per cent on area of 35 cm in diameter (with magnetron antennas arranged in 30x30 cm plane and facing substrate) for both silica and silicon nitride films. Maximal growth rate obtained without compromising the quality of material is up to 6 nm/sec for SiO@sub 2@ and 1 nm/sec for Si@sub 3@N@sub 4@. Films are found to be dense and have good adhesion to polycarbonate.