AVS 46th International Symposium
    Plasma Science and Technology Division Thursday Sessions

Session PS1-ThA
High Fidelity Pattern Transfer

Thursday, October 28, 1999, 2:00 pm, Room 612
Moderator: K.H.A. Bogart, Lucent Technologies


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Click a paper to see the details. Presenters are shown in bold type.

2:00pm PS1-ThA1 Invited Paper
High Fidelity Pattern Transfer
K. Kasama, K. Yoshida, N. Ikezawa, T. Uchiyama, NEC Corporation, Japan
2:40pm PS1-ThA3
High Volume Self Aligned Contact Etch for SRAM
U. Raghuram, J.E. Nulty, Cypress Semiconductor
3:00pm PS1-ThA4
High Density Plasma Oxide Etching of SAC (Self-Aligned Contact) and 0.25 micron HARC (High Aspect Ratio Contact) Structures: Process and Repeatability Results
L. Marquez, B. Bosch, O. Turmel, S. Darcy, J.M. Cook, Lam Research
3:20pm PS1-ThA5
The Angular Dependence of SiO@sub 2@, Si@sub 3@N@sub 4@, and Poly-Silicon Etching Rates in Inductively Coupled Fluorocarbon Plasmas
C. Hedlund, F. Engelmark, H.-O. Blom, Uppsala University, Sweden, M. Schaepkens, G.S. Oehrlein, State University of New York at Albany
3:40pm PS1-ThA6
Process Optimization of Plasma Polymerized Resists for Advanced Lithography Applications
O. Joubert, CNET/CNRS, France, C. Monget, L. Vallier, CNET France Telecom, T.W. Weidman, Applied Materials
4:00pm PS1-ThA7
DUV Resist Degradation and Surface Roughening under Plasma Exposure
W.H. Yan, Microelectronic Division, IBM Corp., W. Moreau, R. Wise, Y. Cui, IBM Corp.
4:20pm PS1-ThA8
Transfer Etching of Bilayer Resists in Oxygen-based Plasmas
A.P. Mahorowala, K. Babich, Q. Lin, D.R. Medeiros, K. Petrillo, J. Simons, M. Angelopoulos, IBM T.J. Watson Research Center, G.W. Reynolds, J.W. Taylor, University of Wisconsin, Madison
4:40pm PS1-ThA9
Integration of Metal Masking and Etching for Deep Submicron Patterning
C.T. Gabriel, R. Kim, D.C. Baker, VLSI Technology
5:00pm PS1-ThA10
Manufacturable Aluminum RIE Processes for 150 nm and Beyond
G. Stojakovic, X.J. Ning, Siemens Microelectronics Inc. at IBM/Siemens/Toshiba DRAM Development Alliance, E.W. Kiewra, IBM Microelectronics at IBM/Siemens/Toshiba DRAM Development Alliance, W. Kocon, IBM Microelectronics