| AVS 46th International Symposium | |
| Manufacturing Science and Technology Group | Thursday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:20am | MS+PS-ThM1 Invited Paper ESH as One of the Key Criteria for Semiconductor Process Development A. Bowling, T. Wooldridge, J. DeGenova, T. Yeakley, T. Gilliland, A. Cheng, L. Moyer, Texas Instruments Inc. |
| 9:00am | MS+PS-ThM3 Invited Paper The Environmental Impact of Perfluorinated Compounds used in the Semiconductor Industry R.F. Jewett, Litmas Corp. |
| 9:40am | MS+PS-ThM5 Invited Paper Optimization of Processing Plasmas in the Semiconductor Industry for Minimal Environmental Impact J.G. Langan, Air Products and Chemicals, Inc. |
| 10:20am | MS+PS-ThM7 PFC Abatement in Inductively Coupled Plasma Reactors using O@sub 2@, H@sub 2@ and H@sub 2@O as Additive Gases@footnote 1@ X. Xu, M.J. Kushner, University of Illinois, Urbana |
| 10:40am | MS+PS-ThM8 Modeling of Nonisothermal, Coupled Neutral/Plasma Dynamics in PFC Abatement Plasmas M.W. Kiehlbauch, A. Fiala, E.J. Tonnis, D.B. Graves, University of California, Berkeley |
| 11:00am | MS+PS-ThM9 Remote Plasma Sources for Cleaning CVD Reactors: Development and Implementation of a Technology for Green Manufacturing of Integrated Circuits S. Raoux, M. Sarfaty, T. Nowak, K.C. Lai, H.T. Nguyen, S. Thurwachter, J. Schoening, D. Silvetti, M. Barnes, Applied Materials |
| 11:20am | MS+PS-ThM10 Study of NF@sub 3@-Based High Density Plasma Oxide Etch Processes for Reduced Global Warming Emissions L.C. Pruette, S.M. Karecki, R. Chatterjee, R. Reif, Massachusetts Institute of Technology |
| 11:40am | MS+PS-ThM11 Environmentally Harmonized Silicon Oxide Selective Etching Process Employing Novel Radical Injection Technique K. Fujita, S. Kobayashi, M. Hori, T. Goto, Nagoya University, Japan, M. Ito, Wakayama University, Japan |