AVS 46th International Symposium
    Manufacturing Science and Technology Group Thursday Sessions
       Session MS+PS-ThM

Invited Paper MS+PS-ThM1
ESH as One of the Key Criteria for Semiconductor Process Development

Thursday, October 28, 1999, 8:20 am, Room 611

Session: Environmentally Benign Manufacturing
Presenter: A. Bowling, Texas Instruments Inc.
Authors: A. Bowling, Texas Instruments Inc.
T. Wooldridge, Texas Instruments Inc.
J. DeGenova, Texas Instruments Inc.
T. Yeakley, Texas Instruments Inc.
T. Gilliland, Texas Instruments Inc.
A. Cheng, Texas Instruments Inc.
L. Moyer, Texas Instruments Inc.
Correspondent: Click to Email
During the development of advanced semiconductor devices, great benefit has been observed by treating ESH as a key process development specification. Earlier it had been feared that one must sacrifice process performance and/or cost to pursue ESH goals. However, in actuality, the process development engineer has frequently found that a process optimized for ESH also has better performance and lower cost per wafer. This paper will give a number of examples where ESH optimization has produced such performance and cost benefits. These examples include DI-water recycling, dilute SC1 wafer cleaning, wafer rinse optimization, dilute HMDS for resist develop, plasma-enhanced chemical vapor deposition (CVD) chamber cleaning optimization of PFC emissions, capture and recycling of copper plating solutions, copper CVD precursor recovery and recycling, post-metal etch solvent clean optimization, vacuum pump oil reclamation/optimization, and IPA recovery and recycling. The paper will conclude that ESH should be treated as another process performance and cost variable just like etch/deposition rate, non-uniformity, and particle counts.