AVS 46th International Symposium
    Manufacturing Science and Technology Group Thursday Sessions
       Session MS+PS-ThM

Paper MS+PS-ThM9
Remote Plasma Sources for Cleaning CVD Reactors: Development and Implementation of a Technology for Green Manufacturing of Integrated Circuits

Thursday, October 28, 1999, 11:00 am, Room 611

Session: Environmentally Benign Manufacturing
Presenter: S. Raoux, Applied Materials
Authors: S. Raoux, Applied Materials
M. Sarfaty, Applied Materials
T. Nowak, Applied Materials
K.C. Lai, Applied Materials
H.T. Nguyen, Applied Materials
S. Thurwachter, Applied Materials
J. Schoening, Applied Materials
D. Silvetti, Applied Materials
M. Barnes, Applied Materials
Correspondent: Click to Email
The semiconductor industry is pursuing efforts to reduce emission of global warming PFC gases. Recently, a major advance in dielectric CVD (chemical vapor deposition) chamber cleaning has been introduced that virtually eliminates PFCs emissions from the process. Using NF@sub 3@ gas in a remote plasma source, the near complete dissociation of the gas achieves both superior chamber cleaning performance and improved environmental friendliness. In this paper, we will present experimental data (Mass and IR spectroscopy, Optical Emission Spectroscopy) used to identify the major phenomena related to the destruction of NF3 molecules, the generation of reactive (F) species, the recombination of atomic fluorine into F2 molecules and the efficiency of (SiO2, SiN,...) deposition residue removal. We will review the design requirements for this Remote Clean@super TM@ technology with respect to environmental and process performance, manufacturability, integration to the CVD process tool, and energy efficiency. An environmental (EnV) analysis was conducted, based on a process architecture framework, manufacturing process modeling, and multi-dimensional characterization. The EnV analysis integrates ESH impacts, manufacturing costs, and process performance measurements into a larger systems view with dynamic process models, established business processes, and an upstream design approach. The analysis methodology is presented along with a case study to compare an in situ C2F6-based RF clean with the Remote Clean@super TM@ technology.