| AVS 45th International Symposium | |
| Plasma Science and Technology Division | Thursday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| PS-ThP1 Improvement on Lithography Pattern Profile by Plasma Treatment C.P. Soo, National University of Singapore, M.H. Fan, Chartered Semiconductor Manufacturing Ltd., Singapore, A.J. Bourdillon, National University of Singapore, L.H. Chan, Chartered Semiconductor Manufacturing Ltd, Singapore |
| PS-ThP2 Tantalum Film for X-ray Lithography Mask Deposited by Electron Cyclotron Resonance Plasma Source Coupled with Divided Microwaves H. Nishimura, T. Ono, M. Oda, S. Matsuo, NTT System Electronics Laboratories, Japan |
| PS-ThP3 Control of Ion Energy Distribution at Substrates During Plasma Processing S.B. Wang, A.E. Wendt, University of Wisconsin, Madison |
| PS-ThP4 Simulations of Electronegative Discharge Sheaths@footnote 1@ S.K. Kanakasabapathy, J.L. Kleber, L.J. Overzet, University of Texas, Dallas |
| PS-ThP5 Negative Ions in Inductively Coupled Plasmas@footnote 1@ J.L. Kleber, L.J. Overzet, University of Texas, Dallas |
| PS-ThP6 Time Resolved Electrostatic Probe Measurements of Electron Temperature and Plasma Density Radial Profiles in a Pulsed ICP Plasma X.M. Tang, D.M. Manos, College of William and Mary |
| PS-ThP7 Electron and Negative Ion Density in BCl@sub 3@ / Cl@sub 2@ / Ar Gas Mixtures G.A. Hebner, M.G. Blain, T.W. Hamilton, C.A. Nichols, R.L. Jarecki, Sandia National Laboratories |
| PS-ThP8 Rare Gas Dilution of Fluorocarbon Plasmas: Te Measurements using TRG-OES and Processing Implications H.L. Maynard, Bell Laboratories, Lucent Technologies, M.V. Malyshev, Bell Laboratories (Also at Princeton University), W.W. Tai, V.M. Donnelly, Bell Laboratories, Lucent Technologies |
| PS-ThP9 Molecular Dynamics Simulation of Cu and Ar Ion Sputtering of Cu Surfaces@footnote 1@ J.D. Kress, D.E. Hanson, A.F. Voter, Los Alamos National Laboratory, C.-L. Liu, D.G. Coronell, Motorola |
| PS-ThP10 Monte-Carlo Simulation of Atomic Scale InP Surface Etching L. Houlet, A. Rhallabi, G. Turban, Institut des Materiaux de Nantes, France |
| PS-ThP11 Analysis of Fast Neutrals in Plasma Monitoring J. Wei, R.E. Pedder, ABB Extrel |
| PS-ThP12 The Application of Helicon Antennas as a Secondary Plasma Source for Ionized PVD D.B. Hayden, D.N. Ruzic, D.R. Juliano, M.M.C. Allain, University of Illinois, Urbana |
| PS-ThP13 CF@sub 2@, CF Radical Behaviors in a Magnetized Inductively Coupled Plasma and the Correlation with Oxide Etch Characteristics J.H. Kim, H.J. Lee, K.W. Whang, Seoul National University, South Korea, J.H. Joo, Kunsan National University, South Korea |
| PS-ThP14 Determination of Gas Phase Species Concentrations in High Density Plasmas for Dielectric Deposition M.L. Jezl, R.C. Woods, University of Wisconsin, Madison |
| PS-ThP15 Characterization of the Reactive Species in a Helium/Oxygen Atmospheric-Pressure Plasma Jet J.Y. Jeong, S.E. Babayan, A. Schuetze, University of California, Los Angeles, J. Park, I. Henins, Los Alamos National Laboratory, R.F. Hicks, University of California, Los Angeles, G.S. Selwyn, Los Alamos National Laboratory |