| AVS 45th International Symposium | |
| Plasma Science and Technology Division | Thursday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:20am | PS-ThM1 Invited Paper Plasma Processes for Copper Dual Damascene Interconnect in Advanced CMOS Technologies J.E. Heidenreich, D. Edelstein, R. Goldblatt, W. Cote, C. Uzoh, IBM - Semiconductor R & D Center, T. McDevitt, A. Stamper, IBM Microelectronics, A.H. Simon, IBM - Semiconductor R & D Center, J. Dukovic, IBM T.J. Watson Research Center, R. Wachnik, H. Rathore, IBM - Semiconductor R & D Center, S. Luce, J. Slattery, IBM Microelectronics, J. Ryan, IBM - Semiconductor Research and Development Center |
| 9:00am | PS-ThM3 Low k Dielectric Etching in High Density Plasmas O. Joubert, France Telecom CNET/DTM/TFM, L. Vallier, P. Czuprynski, France Telecom CNET |
| 9:20am | PS-ThM4 High Density Plasma Patterning of Organic Low Dielectric Constant Materials T.E.F.M. Standaert, P.J. Matsuo, S.D. Allen, State University of New York, Albany, K.H.J.M. Robben, Eindhoven University of Technology, The Netherlands, G.S. Oehrlein, State University of New York, Albany, J.G. Langan, W.R. Entley, Air Products and Chemicals, Inc., R. Gutmann, T.M. Lu, Rensselaer Polytechnic Institute |
| 9:40am | PS-ThM5 Invited Paper Plasma Deposition of Low-Dielectric-Constant Fluorinated Amorphous Carbon Interlayer Dielectrics K. Endo, NEC Corporation, Japan |
| 10:20am | PS-ThM7 Sources of Asymmetry in Ionized Metal PVD Reactors@footnote 1@ J. Lu, M.J. Kushner, University of Illinois, Urbana-Champaign |
| 10:40am | PS-ThM8 Simulations for Process Optimization Issues in Ionized Metal PVD P.L.G. Ventzek, M. Hartig, V. Arunachalam, D.G. Coronell, D. Denning, Motorola Inc. |
| 11:00am | PS-ThM9 Modeling of IMP Copper for Electroplating Seed Layer Application H.M. Zhang, I. Hashim, P.J. Ding, B. Chin, J.C. Forster, Applied Materials |
| 11:20am | PS-ThM10 Metal Flux Ionization Fraction in Copper Ionized Physical Vapor Deposition@footnote 1@ T.G. Snodgrass, J.E. Foster, S. Lu, A.E. Wendt, J.H. Booske, J.L. Shohet, University of Wisconsin, Madison |
| 11:40am | PS-ThM11 Scattering and Sputtering Processes of Energetic Ar@super +@ and Cu@super +@ Ions on Cu Surfaces: Molecular Dynamics Simulations C.F. Abrams, D.B. Graves, University of California, Berkeley |