| AVS 45th International Symposium | |
| Electronic Materials and Processing Division | Wednesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:20am | EM-WeM1 Invited Paper Surface Preparation and Contamination Control for Advanced CMOS Processing S.C. O'Brien, Texas Instruments |
| 9:00am | EM-WeM3 Dissolution of Cu and Au into Aqueous Semiconductor Processing Solutions I. Suni, D. Chopra, A.A. Busnaina, Clarkson University |
| 9:20am | EM-WeM4 A Reduced Carbon Contaminant, Very Low-Temperature Silicon Substrate Preparation for Defect-Free Homoepitaxy P.J. Taylor, W.A. Jesser, University of Virginia, M. Martinka, K. Singley, J. Dinan, US Army CECOM-Night Vision and Electronic Sensors Directorate, R. Lareau, M. Wood, W.W. Clark III, US Army Research Laboratory |
| 9:40am | EM-WeM5 The Modeling of Excimer Laser Particle Removal From Silicon Surfaces X. Wu, E. Sacher, M. Meunier, École Polytechnique de Montréal, Canada |
| 10:00am | EM-WeM6 Chelating Agents for Dry Removal of Metals A. Shah, L. Ford, L. Nigg, Y. Wang, R. Masel, University of Illinois, Urbana |
| 10:20am | EM-WeM7 Invited Paper Process Optimization of CMP of Dielectrics for ULSI Multilevel Metallization H.W.A. Treichel, OnTrak Systems, Inc., R. Frausto, A. Meyer, R. Morishige, S. Srivatsan, B. Withers, Lam Research Corporation |
| 11:00am | EM-WeM9 Nanoscale Corrosive Wear of Ionic Materials: A Model System for Chemical Mechanical Polishing J.T. Dickinson, L. Scudiero, S.C. Langford, Washington State University |
| 11:20am | EM-WeM10 Studies on Passivation Behavior of Tungsten in Application to Chemical Mechanical Polishing D. Tamboli, S. Seal, A. Kale, V. Desai, University of Central Florida, Y. Obeng, A. Maury, Bell Laboratories, Lucent Technologies |
| 11:40am | EM-WeM11 Studies of the Pad-Slurry-Surface Interactions in Chemical-Mechanical Polishing of Copper Thin Films and Patterned Structures J. Hernandez, P. Wrschka, G.S. Oehrlein, State University of New York, Albany, J. King, Cybeq Nano Technologies |