AVS 45th International Symposium
    Electronic Materials and Processing Division Thursday Sessions

Session EM-ThP
Electronic Materials and Processing Poster Session

Thursday, November 5, 1998, 5:30 pm, Room Hall A


  Click here to Download program book for this session  
  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

EM-ThP1
Synthesis and I-V Characterization of Tin Dioxide Varistors
A. Kale, University of Central Florida, R.N. Barve, College of Engineering, India, S.K. Date, National Chemical Laboratories, India, P.N. Santhosh, Indian Institute of Science, India, S. Seal, University of Central Florida
EM-ThP2
First Principles Calculations of Ge (100) Covered by Up to One Monolayer of Pb
N. Takeuchi, Universidad Nacional Autonoma de Mexico
EM-ThP3
TEM Study of TiAl@sub3@ Formation
C.C. Pace, University of North Carolina, Chapel Hill and MCNC, M.K. Lamvik, M.A. Ray, Microelectronics Center of North Carolina, A. McTeer, Micron Technology
EM-ThP4
Side-Wall Damage in a Transmission Electron Microscopy Specimen of Crystalline Silicon Prepared by a Focused-Ion-Beam
N. Kato, IBM, Japan, H. Saka, Nagoya University, Japan, Y. Kohno, IBM, Japan
EM-ThP5
Heat-Transfer in UHV-Scanning Thermal Microscopy
W. Müller-Hirsch, J.P. Parisi, M.T. Hirsch, A. Kittel, University of Oldenburg, Germany, L.V. Govor, A.Yu. Olevanov, The State University of Belarus
EM-ThP6
Boron Phosphide Films Grown by Solid-Source Molecular Beam Epitaxy
D. Buchenauer, D. Dibble, K.F. McCarty, J.C. Lund, R.J. Anderson, M. Clift, D.L. Medlin, J.A. Schneider, Sandia National Laboratories
EM-ThP7
Effects of Variously Configured Magnets on the Characteristics Of Inductively Coupled Plasmas
S.W. Hwang, Y.J. Lee, SungKyunKwan University, Korea, S.W. Joe, Kyoungki University, Korea, K.H. Kim, Hanyang University, Korea, G.Y. Yeom, SungKyunKwan University, Korea
EM-ThP8
Atomic Order and Electron Affinity at AlN(0001) Surfaces
C.I. Wu, A. Kahn, Princeton University, E.S. Hellman, D.N.E. Buchanan, Bell Laboratories, Lucent Technologies
EM-ThP9
Enhanced Electrical Performance of Au/n-GaN Schottky Diodes by Novel Processing
L. He, Northern Illinois University, X.J. Wang, University of Maryland at Baltimore County
EM-ThP10
W-Based Ohmic Contacts on p- and n-Type GaN
X. Cao, F. Ren, S.J. Pearton, University of Florida, Gainesville, A. Zeitouny, M. Eizenberg, Technion-Israel Institute of Technology, J.C. Zolper, Office of Naval Research, C.R. Abernathy, University of Florida, Gainesville, R.J. Shul, Sandia National Laboratories, J.R. Lothian, Bell Laboratories, Lucent Technologies
EM-ThP11
Redistribution and Activation of Implanted S, Se, Te, Be, Zn and C in GaN
R.G. Wilson, Consultant, J.M. Zavada, U.S. Army Research Office, X. Cao, S.J. Pearton, R.K. Singh, University of Florida, Gainesville, M. Fu, J.A. Sekhar, V. Sarvepalli, Mycropyretics Heaters International, R.J. Shul, J. Han, D.J. Rieger, Sandia National Laboratories, C.R. Abernathy, University of Florida, Gainesville
EM-ThP12
Etch Characteristics of GaN using Chemically Assisted Ion Beam Etching(CAIBE) and Its Effects on Ohmic Contact Formation to n-type GaN
W.J. Lee, G.Y. Yeom, Sungkyunkwan University, Korea, J.W. Lee, Y.J. Park, T.I. Kim, Samsung Advanced Institute of Technology, Korea
EM-ThP13
Growth of ß-SiC Thin Films on Si (100) at Low Temperature using Ultra-high Vacuum Electron Cyclotron Resonance Chemical Vapor Deposition
J.H. Pyo, K.W. Whang, Seoul National University, Korea
EM-ThP14
Study of Pulsed versus Continuous Wave Plasma Deposition of Amorphous, Hydrogenated Silicon Carbide (a-Si@sub1-x@C@sub x@:H) from Silane/Methane Mixtures
P.M. McCurdy, J.M. Truitt, E.R. Fisher, Colorado State University