AVS 45th International Symposium
    Plasma Science and Technology Division Wednesday Sessions
       Session PS-WeM

Paper PS-WeM9
Vacuum Ultraviolet Spectra of Metal-Etch Plasma Processing Discharges

Wednesday, November 4, 1998, 11:00 am, Room 318/319/320

Session: Plasma Damage
Presenter: J.R. Woodworth, Sandia National Laboratories
Authors: J.R. Woodworth, Sandia National Laboratories
M.G. Blain, Sandia National Laboratories
R.L. Jarecki, Sandia National Laboratories
T.W. Hamilton, Sandia National Laboratories
B.P. Aragon, Sandia National Laboratories
Correspondent: Click to Email
We report measurements of the absolute fluxes of vacuum ultraviolet (VUV) photons to the wafer in a commercial aluminum-etch inductively coupled plasma processing tool for discharges containing chlorine, boron trichloride and argon. Most of the VUV emissions that we observed above 8 eV in these discharges were due to spectral lines of neutral chlorine atoms. Spectra and absolute fluxes as a function of rf power, substrate type, gas mixture, and pressure will be presented. This work was supported by the United States Department of Energy Under Contract No. AC04-94AL8500, by SEMATECH, and by Applied Materials. Sandia is a multiprogram laboratory operated by the Sandia Corporation, a Lockheed Martin Company, for the United States Department of Energy.