| AVS 64th International Symposium & Exhibition | |
| Thin Films Division | Wednesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:00am | TF+EM+MI-WeM1 Electrode Modulated Electric Field Capacitance Nonlinearity in ALD Al2O3 and HfO2 Metal-Insulator-Metal Capacitors D.Z. Austin, K. Holden, John Conley, Jr., Oregon State University |
| 8:20am | TF+EM+MI-WeM2 Difference of the Hysteresis in Capacitance-voltage Characteristics of ALD-Al2O3 MIS Capacitors on Si and GaN Substrate Masaya Saito, T. Suwa, A. Teramoto, Tohoku University, Japan, T. Narita, Toyota Central R&D Labs. Inc., Japan, T. Kachi, Nagoya University, Japan, R. Kuroda, S. Sugawa, Tohoku University, Japan |
| 8:40am | TF+EM+MI-WeM3 Monolithic Integration of C-type Erbium Oxide on GaN(0001) by Atomic Layer Deposition Pei-Yu Chen, A. Posadas, The University of Texas at Austin, S. Kwon, Q. Wang, M. Kim, The University of Texas at Dallas, A. Demkov, J.G. Ekerdt, The University of Texas at Austin |
| 9:00am | TF+EM+MI-WeM4 High-Performance p-Type Thin Film Transistors Using Atomic-Layer-Deposited SnO Films S.H. Kim, I.-H. Baek, J.J. Pyeon, Korea Institute of Science and Technology, Republic of Korea, T.-M. Chung, J.H. Han, Korea Research Institute of Chemical Technology, Republic of Korea, SeongKeun Kim, Korea Institute of Science and Technology, Republic of Korea |
| 9:20am | TF+EM+MI-WeM5 Invited Paper Recent Progresses of Atomic Layer Deposited Oxide Semiconductors for Emerging Display Applications Jin-Seong Park, J. Sheng, J.H. Lee, Hanyang University, Republic of Korea |
| 11:00am | TF+EM+MI-WeM10 Silicon Nitride Thin Films Grown by Hollow Cathode Plasma-Enhanced ALD using a Novel Chlorosilane Precursor Xin Meng, H.S. Kim, A.T. Lucero, J.S. Lee, Y.-C. Byun, J. Kim, University of Texas at Dallas, B.K. Hwang, X. Zhou, M. Telgenhoff, J. Young, Dow Chemical |
| 11:20am | TF+EM+MI-WeM11 Removal of Charge Centers in Hafnia Films by Remote Plasma Nitruration Orlando Cortazar-Martínez, J.A. Torres-Ochoa, C.L. Gomez-Muñoz, A. De Luna-Bugallo, A. Herrera-Gomez, CINVESTAV-Unidad Queretaro, Mexico |
| 11:40am | TF+EM+MI-WeM12 Seam-free Bottom-up Filling of Trenches with HfO2 using Low Temperature CVD Tushar Talukdar, W.B. Wang, E. Mohimi, G.S. Girolami, J.R. Abelson, University of Illinois at Urbana-Champaign |
| 12:00pm | TF+EM+MI-WeM13 Low-κ Organosilicon Thin Films Deposited by iCVD for Electrical Insulation of Through Silicon Vias Mélanie Lagrange, C. Ratin, M. Van-Straaten, C. Ribière, T. Mourier, V. Jousseaume, CEA-Leti, France |