AVS 64th International Symposium & Exhibition
    Manufacturing Science and Technology Group Wednesday Sessions

Session MS+AS-WeA
Advanced Surface, Interface, and Structural Characterization for High Volume Manufacturing

Wednesday, November 1, 2017, 2:20 pm, Room 5 & 6
Moderator: Alain C. Diebold, Colleges of Nanoscale Science and Engineering, SUNY Polytechnic Institute


  Click here to Download program book for this session  
  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

2:20pm MS+AS-WeA1 Invited Paper
The Cornell High Energy Synchrotron Source Upgrade: Current and Future Capabilities for Thin-film Research
Arthur Woll, Cornell University
3:00pm MS+AS-WeA3 Invited Paper
Using Synchrotron XRD Techniques to Impact Microelectronics Manufacturing Technologies
Jean Jordan-Sweet, C. Lavoie, IBM T.J. Watson Research Center, A.V. Carr, IBM Research, Albany, NY, N. Breil, IBM SRDC, East Fishkill; now with Applied Materials Inc., M.M. Frank, IBM T.J. Watson Research Center
4:20pm MS+AS-WeA7 Invited Paper
Development of Ultra-thin ALD Grown high-k Dielectrics and Interconnect Diffusion Barrier Layers aided by Advanced X-ray Structural Analysis for sub 10nm Nodes
Steven Consiglio, K. Tapily, R.D. Clark, C.S. Wajda, K.-H. Yu, T. Hakamata, G.J. Leusink, TEL Technology Center, America, LLC, S. Dey, A.C. Diebold, Colleges of Nanoscale Science and Engineering, SUNY Polytechnic Institute
5:00pm MS+AS-WeA9
Stress Control of rf Sputter Deposition of Piezoelectric Sc0.12Al0.88N
Michael Henry, R.P. Timon, T.R. Young, E.A. Douglas, B. Griffin, Sandia National Laboratories