| AVS 62nd International Symposium & Exhibition | |
| Thin Film | Tuesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:00am | TF+EM+MI+MS-TuM1 Invited Paper FAST-ALDTM with Close Proximity (CP) Plasma for Low Temperature Applications: Nano-Composite Layer (NCL) Stacks for Flexible Substrates SangIn Lee, Veeco |
| 8:40am | TF+EM+MI+MS-TuM3 Atmospheric Roll-to-Roll Spatial Molecular Layer Deposition for flexible barriers Fieke van den Bruele, F. Grob, P. Poodt, Holst Centre / TNO, Netherlands |
| 9:00am | TF+EM+MI+MS-TuM4 Low Temperature, Temporal and Spatial Atomic Layer Deposition of TiO2 using Titanium Tetra-Isopropoxide as Precursor Morteza Aghaee, Eindhoven University of Technology, Netherlands, P.S. Maydannik, Lappeenranta University of Technology, Finland, P. Johansson, Tampere University of Technology, Finland, M. Creatore, Eindhoven University of Technology, Netherlands, T. Homola, D.C. Cameron, Masaryk University, Czech Republic, J. Kuusipalo, Tampere University of Technology, Finland |
| 9:20am | TF+EM+MI+MS-TuM5 Spatial Atomic Layer Deposition into Flexible Porous Substrates Kashish Sharma, University of Colorado at Boulder, D. Routkevitic, N. Varaksa, In Redox, S.M. George, University of Colorado at Boulder |
| 9:40am | TF+EM+MI+MS-TuM6 Accurate Precursor and Reactant Delivery for Quantitative Atomic Layer Deposition Masafumi Kitano, Stanford University, M. Nagase, N. Ikeda, Fujikin Incorporated, Japan, P.C. McIntyre, Stanford University |
| 11:00am | TF+EM+MI+MS-TuM10 Invited Paper ALD for Capacitor Technologies Ramakrishnan Rajagopalan, C. Randall, The Pennsylvania State University |
| 11:40am | TF+EM+MI+MS-TuM12 Compositionally and Functionally Graded Hybrid Layer for High-Performance Adhesion Yichuan Ding, R.H. Dauskardt, Stanford University |