| AVS 56th International Symposium & Exhibition | |
| Manufacturing Science and Technology | Thursday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 2:00pm | MS-ThA1 Invited Paper Nanoelectrical and Nanomechanical Interconnect and Device Metrology for CMOS Extension R.E. Geer, C.H. Chong, Y. Wang, University at Albany |
| 2:40pm | MS-ThA3 New Mechanism for Optically Stimulated Point Defect Control In Ultra-Shallow Junction Formation P. Gorai, Y. Kondratenko, E.G. Seebauer, University of Illinois at Urbana-Champaign |
| 3:00pm | MS-ThA4 Thickness/Composition Metrology of Ultra-thin Lanthanum Oxide Cap Layer for CMOS Metal Gate Work Function Tuning C.C. Wang, Y. Cao, G. Liu, X. Tang, Y. Uritsky, S. Gandikota, Applied Materials Inc. |
| 3:40pm | MS-ThA6 Sidewall Image Transfer for Sub Lithographic Pitch Scaling for the 22nm CMOS Node & Beyond S. Kanakasabapathy, IBM Research, R.H. Kim, Global Foundries, A. Ko, A. Metz, Tokyo Electron Limited, Japan, T. Osabe, Hitachi Technologies, Japan, S. Schmitz, T. Standaert, IBM Systems and Technology |
| 4:00pm | MS-ThA7 Wafer-level Process Sampling, Metrology and Testing for MEMS and Solar Photovoltaic Applications V. Ngo, FEI Company |
| 4:20pm | MS-ThA8 Establish Degradation Rates of Photovoltaic Modules and Systems Trough Comprehensive Electrical and Mechanical Analysis A. Leyte-Vidal, K. Davis, W. Wilson, R. Reedy, N. Hickman, Florida Solar Energy Center, S. Kurtz, National Renewable Energy Laboratory |