| AVS 55th International Symposium & Exhibition | |
| MEMS and NEMS | Monday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 2:00pm | MN+NC-MoA1 Invited Paper Large Area Nanofabrication for MEMS Applications L.E. Ocola, A. Imre, Argonne National Laboratory |
| 2:40pm | MN+NC-MoA3 Large-scale Fabrication of Silicon Nanowire NEMS Devices Using a Top-down Approach C.S. Roper, University of California, Berkeley, R.T. Howe, Stanford University, R. Maboudian, University of California, Berkeley |
| 3:00pm | MN+NC-MoA4 Fabrication of Nanopore and Nanochannel Structures through E-Beam Lithography and Atomic Layer Deposition Processes S.W. Nam, IBM T.J. Watson Research Center & Seoul National University, Korea, M.J. Rooks, R. Sirdeshmukh, IBM T.J. Watson Research Center, K.B. Kim, IBM T.J. Watson Research Center & Seoul National University, Korea, S.M. Rossnagel, IBM T.J. Watson Research Center |
| 3:20pm | MN+NC-MoA5 Fabrication of Nickel-tipped Cantilevers for Magnetic Resonance Force Microscopy S.A. Hickman, Cornell University, J. Van Delden, Eigenphase Technologies, L.E. Harrell, United States Military Academy, S.R. Garner, J.C. Ong, S. Kuenh, J.A. Marohn, Cornell University |
| 4:00pm | MN+NC-MoA7 A Process for Control of the Support Conditions of Nanomechanical Beam Resonators, and Evaluation of the Resulting Impact on Mechanical Dissipation R. Barton, S.S. Verbridge, B.R. Ilic, H.G. Craighead, J.M. Parpia, Cornell University |
| 4:20pm | MN+NC-MoA8 Dynamic-Mode Multidirectional UV Lithography with Liquid State Photoresist J.K. Kim, Y.K. Yoon, University at Buffalo |
| 4:40pm | MN+NC-MoA9 Development of High Rate Etching for Deep Si Etching in Advanced NLD Plasma T. Murayama, T. Morikawa, K. Suu, ULVAC, Inc., Japan |
| 5:00pm | MN+NC-MoA10 XeF2 Etching of Si and Mo for MEMS Manufacturing J.-F. Veyan, Y.J. Chabal, University of Texas at Dallas, X.-M. Yan, A. Londergan, E. Gousev, Qualcomm |
| 5:20pm | MN+NC-MoA11 A Versatile, Bilayer Resist Method for Creating Silica Microstructures B.R. Cipriany, B.R. Ilic, H.G. Craighead, Cornell University |