AVS 55th International Symposium & Exhibition | |
MEMS and NEMS | Monday Sessions |
Session MN+NC-MoA |
Session: | Fabrication at the Micro- and Nano- Scales for MEMS/NEMS |
Presenter: | J.K. Kim, University at Buffalo |
Authors: | J.K. Kim, University at Buffalo Y.K. Yoon, University at Buffalo |
Correspondent: | Click to Email |
Recently an advanced ultraviolet (UV) lithography scheme, where UV is applied to liquid state photoresist, has been introduced with several advantages such as short process time with quick develop/rinse, and in-situ surface modification.1 The container with liquid photoresist remains in a horizontal position to vertically incident light, resulting in relatively simple micro structures. In this research, a multidirectional UV lithography process has been developed with liquid state photoresist for complex three dimensional (3-D) microstructures, where the UV source and a substrate containing liquid photoresist have an arbitrary angle each other. A leak free container has been devised to hold liquid photoresist and is capped with the photomask plate. The container set is attached to a computer controlled movable stage with tilting and rotational functionality.2 A liquid state negative tone photopatternable polyurethane, LF55GN has been utilized for test since it shows fast realization of thick structures with high aspect ratio.2 While the liquid state photoresist is exposed to UV, the stage is dynamically tilted and rotated in slow speed, at which the friction force should be greater than the inertia effect for the given viscosity of the photoresist and therefore the container and the enclosed liquid move as a single body in a quasi-static mode. This developed scheme provides all advantages of both the high aspect ratio complex 3-D micropatterning of multidirectional UV lithography with SU-82 and the rapid process time of UV lithography with liquid state photoresist.1 As the height of the container determines the height of the structure, several thousand micro meter thick film can be easily realized unlike the spin coating approach where the thickness is limited to several hundred micrometers. Thus complex 3-D structures which are more than 1000 micrometers tall structures have been successfully demonstrated in 30 minutes. Ray tracing with regard to the stage movement has been simulated. The shapes of the fabricated structures show good agreement with those of the simulated structures. A single vertical triangular slab and an array have been demonstrated as test structures.
1A. Sayah et al JMEMS 2007, vol.16, no.3, pp.564-570, June
2J.K. Kim et al MEMS 2008. Conference, vol., no., pp.399-402, Jan.