AVS 66th International Symposium & Exhibition | |
Thin Films Division | Friday Sessions |
Session TF-FrM |
Session: | Theory and Characterization of Thin Film Properties |
Presenter: | Jingcheng Ma, University of Illinois at Urbana-Champaign |
Authors: | J.M. Ma, University of Illinois at Urbana-Champaign N.M. Miljkovic, University of Illinois at Urbana-Champaign |
Correspondent: | Click to Email |
Dropwise condensation of steam on metallic surfaces coated with thin (~ 1µm) functional hydrophobic films has the potential to achieve remarkable heat transfer coefficients approaching ~100 kW/m2K. However, the long-term durability of these thin films has limited the application of functional coatings for the past century. Although degradation due to steam condensation has been qualitatively described as ‘blistering’, no satisfactory insight exists capable of answering two key questions: what is the mechanism of water vapor mass transfer, and what is the driving force for film delamination. Hence, scientists have been forced to abandon rational thin film development in favor of ad-hoc trial-and-error approaches. Here, we demonstrate that pinholes on hydrophobic coatings are the source of blisters so commonly seen during degradation. By creating shape-controlled pinhole-blister structures in thin deposited films, we show that blisters form in a spatially-controlled order during water vapor condensation from the ambient. The shape, initiation, and growth of the blisters was systematically investigated. Our experiments demonstrate that water vapor is mainly transferred to the blister through spatially-random pinholes which exist in the film after deposition, and the driving force for film delamination is capillary force. Based on the new insights developed here, we propose a non-dimensional pressure to determine the threshold when blistering will be initiated by a pinhole, or when discrete droplets grow up and above pinholes. To the best of our knowledge, our work represents the first quantitative description of blistering initiation. The techniques and insights presented here will inform future work on polymeric thin films to enable their rational and durable design for a variety of applications.