AVS 66th International Symposium & Exhibition
    Thin Films Division Friday Sessions
       Session TF-FrM

Paper TF-FrM12
Ultra-High Purity Process Capability for High-Performance Atomic layer Deposition

Friday, October 25, 2019, 12:00 pm, Room A216

Session: Theory and Characterization of Thin Film Properties
Presenter: Noel O’Toole, Kurt J. Lesker Company
Authors: N. O’Toole, Kurt J. Lesker Company
G.B. Rayner, Jr., Kurt J. Lesker Company
N.A. Strnad, General Technical Services, LLC
D.M. Potrepka, U.S. Army Research Laboratory
Correspondent: Click to Email

Ultra-high purity (UHP) process capability is motivated by the need to produce superior, high-quality thin films and interfaces by atomic layer deposition (ALD) techniques. In particular, UHP equipment design reduces background impurity levels, including oxygen, to limit incorporation during film growth. Creating and maintaining a UHP process environment are also essential for ALD process reproducibility. This presentation will address the potential sources of background contamination, as well as system design requirements to obtain a controlled UHP process environment. Results will be presented that demonstrate the effectiveness of this technology to obtain high-quality titanium nitride thin films by plasma-enhanced ALD (PEALD) techniques.