AVS 66th International Symposium & Exhibition
    Thin Films Division Tuesday Sessions
       Session TF+EM+MI-TuM

Paper TF+EM+MI-TuM12
Precision Defect Engineering of Metal/Insulator/Metal (MIM) Diodes using Localized ALD Transition Metal Impurities in Al2O3 Tunnel Barriers

Tuesday, October 22, 2019, 11:40 am, Room A122-123

Session: Thin Films for Microelectronics, Photonics, and Optoelectronic Applications
Presenter: Konner Holden, Oregon State University
Authors: K.E.K. Holden, Oregon State University
Y. Qi, Oregon State University
J.F. Conley, Jr., Oregon State University
Correspondent: Click to Email

Thin film MIM tunnel diodes are receiving increased interest for high-speed applications such as THz detection and rectenna based energy harvesting. Traditionally, current density vs. field (J-ℰ) asymmetry (ƒasym = J-/J+) with MIM diodes has been achieved through metal work function differences (ΔΦM). Recently, nanolaminate insulator tunnel barrier MIIM diodes enabled by ALD showed improved ƒasym, non-linearity, and responsivity at low voltage by step tunneling through the wider bandgap (EG) insulator to the conduction band of the narrow EG insulator.1 Intrinsic defects present in narrow EG insulators were later demonstrated to further improve low ℰ asymmetry via defect enhanced direct tunneling, when paired with an insulator dominated by tunneling.2,3 In this work, we investigate the impact of localized extrinsic defects by using ALD to intentionally introduce Ni at precise intervals in an Al2O3 tunnel barrier.

ALD of Al2O3 on TiN was performed at 200 °C using TMA and H2O. Five samples were prepared in which a 100 cycle Al2O3 ALD sequence was interrupted by two cycles (c) of Ni(tBu2DAD)2 and O3 after 25, 50, 75, and every 25 c of Al2O3. As-deposited MIM devices were tested with bias applied to an Al top electrode (Fig. 1).

DC J-ℰ sweeps of the 100 c device show Fowler-Nordheim tunneling (FNT) at high ℰ, with ƒasym > 1 due to ΔΦM ≈ 0.2 eV (Fig. 1). The addition of Ni cycles in all cases leads to an increase in J at low ℰ vs. the 100 c Al2O3 device, suggesting defect related conduction. At high ℰ, however, J of all Ni devices is lower than the 100 c device, suggesting suppression of FNT. The 25/2/75 and 75/2/25 (Al2O3/Ni/Al2O3) devices show ƒasym opposite of the 100 c device, while the 50/2/50 and 25/(2/25)x3 devices are roughly symmetric (Fig. 1). The greater reduction in J at large negative ℰ, ƒasym reversal, and reduced J-ℰ slope for the 25/2/75 and 75/2/25 devices suggest that FNT is suppressed more for emission from the smaller ΦM electrode (Al) than for TiN. FNT suppression appears greatest for the 75/2/25 device in which Ni is closest to the Al, pointing to an increase in effective barrier height, likely due to negative charge in the Al2O3. Capacitance (C) vs. ℰ sweeps (Fig. 2) reveal a positive voltage shift in Cmin for all Ni devices, consistent with negative charge.

The asymmetry reversal demonstrates the possibility of precision defect engineering of MIM tunnel devices using ALD. An in-depth discussion of J-ℰ and C-ℰ, temperature-IV, frequency-CV, other impurities, and annealing will be presented.

1. Alimardani et al., APL 102 143501 (2013).

2. Alimardani et al., JAP 116, 024508 (2014).

3. Alimardani and Conley, Jr., APL 105, 082902 (2014).