AVS 66th International Symposium & Exhibition
    Thin Films Division Monday Sessions
       Session TF+2D+AP+EL+SS-MoA

Invited Paper TF+2D+AP+EL+SS-MoA1
ALD on Particles: What is Different from Wafers?

Monday, October 21, 2019, 1:40 pm, Room A124-125

Session: ALD and CVD: Nucleation, Surface Reactions, Mechanisms, and Kinetics
Presenter: Ruud van Ommen, Delft University of Technology, Netherlands
Correspondent: Click to Email

Advanced materials, often relying on nanostructured particles as building blocks, are crucial in meeting grand challenges in energy and health. Atomic layer deposition (ALD) is an excellent technique to make such nanostructured particles: particles of which the surface is either covered by an ultrathin film or by nanoclusters. Although the underlying mechanisms are similar, there are quite some differences between ALD processing of wafers and ALD processing of particles. This presentation will discuss recent developments and insights in the field of applying ALD to particles, with an emphasis on reactor technology, precursor utilization, operating conditions, and scaling up. I will show that ALD is suited to produce nanostructured particles with very high precision. Moreover, it is scalable such that large amounts of such particles can be produced.