AVS 66th International Symposium & Exhibition
    Advanced Ion Microscopy and Ion Beam Nano-engineering Focus Topic Wednesday Sessions
       Session HI+AS+CA-WeA

Paper HI+AS+CA-WeA10
Low Damage Imaging of Polymers with the Helium Ion Microscope

Wednesday, October 23, 2019, 5:20 pm, Room B231-232

Session: Advanced Ion Microscopy and Surface Analysis Applications
Presenter: Doug Wei, Carl Zeiss, RMS, Inc.
Authors: D. Wei, Carl Zeiss, RMS, Inc.
J.A. Notte, Carl Zeiss PCS, Inc.
A. Stratulat, Carl Zeiss Microscopy, Ltd., UK
Correspondent: Click to Email

Polymers present a combination of challenges for high magnification imaging with the conventional SEM or FIB. Because they are electrically insulating, polymers are susceptible to charge accumulation and can produce imaging artifacts. Or worse, the implanted charge and surface charge can generate fields large enough to induce catastrophic dielectric breakdown. The interaction of the primary beam with the chemical bonds can cause radiolysis, cross-linking, and chain scissions which alter their morphology and other properties. Ion beams of relatively heavy species (Ga and Xe) can cause appreciable sputtering especially at high magnifications. In some cases, the sputtering can be preferential for light atoms, causing disproportionate hydrogen loss. Further difficulties include heating effects, since the typical polymers are good thermal insulators. Compounding matters, they are often temperature sensitive and can be damaged at even modest temperature rises ~ 50 deg C.

However, some of the newly available light ion beams (H, He, Li) offer unique advantages that help to circumvent the problems traditionally encountered when imaging polymers. First, the charging effects are greatly diminished compared to the SEM. In part, this is because the incident ion is likely neutralized as it enters the sample, and remains in a mostly neutral state as it penetrates deeply. This leaves only a net surface charge, which is overall positive and made more so by the ejection of secondary electrons from the surface. This is easily resolved using a collection of low energy electrons provided by a flood gun. The light ion beams also have relatively low sputtering rates compared to the heavier ions. Their interactions are primarily with the electrons of the sample. So while they can affect bonding, they are much less likely to cause sputtering. The light ions will generally be implanted deeply, often hundreds of nanometers under the surface, and helium in particular is known to diffuse out over time. Thermal effects are also much reduced with the light ion beams compared to heavier ions or the SEM. The ion’s initial kinetic energy is converted to random thermal energy over a relatively large volume. And much of the transferred energy goes to the electrons in the sample, and their relatively long mean free path helps to dissipate this energy into a larger volume.

Numerous imaging examples will be provided from a variety of polymers using the helium beam from the Zeiss ORION NanoFab. These serve as representative examples of the unique sample interaction of light ions and the advantages they offer for imaging polymers.