AVS 66th International Symposium & Exhibition
    Atomic Scale Processing Focus Topic Thursday Sessions
       Session AP+PS+TF-ThM

Invited Paper AP+PS+TF-ThM1
A Challenge for Selective Atomic Layer Etching of Non-volatile Materials Using Organometalic Complex

Thursday, October 24, 2019, 8:00 am, Room B130

Session: Thermal Atomic Layer Etching
Presenter: Yoshihide Yamaguchi, Hitachi, Japan
Authors: Y. Yamaguchi, Hitachi, Japan
S. Fujisaki, Hitachi, Japan
K. Shinoda, Hitachi, Japan
H. Kobayashi, Hitachi High Technologies, Japan
K. Kawamura, Hitachi High Technologies, Japan
M. Izawa, Hitachi High Technologies, Japan
Correspondent: Click to Email

Remarkable progress on atomic layer etching (ALE) for non-volatile materials has been made in recent years. The typical procedure for thermal ALE of non-volatile materials such as HfO2 is cyclic repetitions of formation and desorption of the organometallic complex at a constant temperature [1]. The most significant problem in thermal ALE is formation of a volatile organometallic complex layer on the surface. The organometallic complex layer prevents diffusion of etching species into the deep at the formation step and must be easily removed at the desorption step. The thermal ALE of La2O3, however, is difficult to apply because the organo-lanthanum complexes are easily decomposed by mild heating (< 200 deg. C) and fail to prevent the diffusion. To solve this thermal instability, the authors have applied a thermal cycle ALE [2,3], which is a combination of a formation of the organo-lanthanum complex at a low temperature and a desorption of the complex at a high temperature. In this paper, several results of our challenge for thermal ALE of non-volatile materials using a selective organo-metallization reaction on the surface will be discussed. Some guiding principles for the organo-metallization reaction will also be explained.

A La2O3 thin-film sputtering deposited on a SiO2/Si wafer was used as a sample. First, the La2O3 film was exposed to vapor mixture of a diketone and a stabilizer as the etchant gas at below 150 deg. C. Then the sample was annealed up to 250 deg. C. Temperature dependence in the procedure was also evaluated. After these consecutive processes, the sample was analyzed by scanning electron microscopy, X-ray photoelectron spectroscopy. Formation of the organo-lanthanum complex showed temperature dependent quasi-self-limiting characteristics. In the lower temperature range, the self-limiting characteristics enable precise control of the organo-lanthanum complex formation. In the higher temperature range, the continuous characteristics enable a higher etch amount per cycle with high selectivity. Several differences between chemistry with and without a stabilizer in the etching gas will be discussed. The high etching selectivity of La2O3 to HfO2 was also demonstrated. From these findings, we conclude that practical ALE of La2O3 has been successfully demonstrated.

[1] Y. Lee et al., Journal of Vacuum Science & Technology A 36, 061504 (2018).

[2] K. Shinoda et al., J. Phys. D: Appl. Phys. 50, 194001 (2017).

[3] Y. Yamaguchi et al., ALE workshop TuM4 (2018).