AVS 66th International Symposium & Exhibition
    Atomic Scale Processing Focus Topic Wednesday Sessions
       Session AP+BI+PS+TF-WeM

Paper AP+BI+PS+TF-WeM5
Analysis of Metal Surface during Atomic Layer Etching with Gas Cluster Ion Beam and Organic Acid

Wednesday, October 23, 2019, 9:20 am, Room B130

Session: Surface Reaction Analysis and Emerging Applications of Atomic Scale Processing
Presenter: Noriaki Toyoda, University of Hyogo, Japan
Authors: N. Toyoda, University of Hyogo, Japan
K. Uematsu, University of Hyogo, Japan
Correspondent: Click to Email

Surface states of metal surface after atomic layer etchings (ALE) with gas cluster ion beam (GCIB) and organic acid were investigated using surface analysis tools (mainly X-ray photoelectron microscopy). In recent years, we have reported the usage of GCIB irradiation for the removal steps of ALE. Since GCIBs are aggregates of thousands of gas atoms or molecules, the energy/atoms or energy/molecules can be easily reduced to several eV even though the total energy of GCIB is several keV. This characteristic is beneficial for low-damage irradiation. In additions, since GCIBs induce dense energy deposition, the bombarded area experiences transient high-temperature and high-pressure conditions. As a result, chemical reactions are enhanced at low-temperature. These characteristics are suitable for the removal step in ALE.

In this study, we have investigated the surface state of metal (Ni, Cu) after ALE with GCIB and organic acid using in-situ XPS. Prior to GCIB irradiation, metal surfaces were cleaned by Ar ions. Then Ni or Cu surface were exposed to acetic acids or acetylacetones. The surface layer with adsorbed organic acid on metals were removed by subsequent GCIB irradiation. The difference of the surface states of metal between Ar and O2-GCIB irradiation are compared with in-situ XPS results. Etching mechanism by GCIB in the presence of the adsorbed organic acid will be discussed.