| AVS 65th International Symposium & Exhibition | |
| MEMS and NEMS Group | Wednesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:00am | MN+NS+PS-WeM1 Invited Paper Miniaturizing 3D Printed Microfluidics: State-of-the-Art and Outlook Greg Nordin, Brigham Young University |
| 8:40am | MN+NS+PS-WeM3 A Novel Inkjet Printing Technology Based on Plasma Conversion of Metal-Salt Based Inks for the Fabrication of Microfabricated Sensors Y. Sui, R.M. Sankaran, Christian Zorman, Case Western Reserve University |
| 9:00am | MN+NS+PS-WeM4 Full Wafer Thickness Through Silicon Vias for MEMS Devices Andrew Hollowell, E. Baca, D. Dagel, M.B. Jordan, L. Menk, K. Musick, T. Pluym, J. McClain, Sandia National Laboratories |
| 9:20am | MN+NS+PS-WeM5 Scaling from Die Level to Full 150 mm Wafer TSV Filling through Fluid Dynamics Modeling and Current Controlled Deposition Ehren Baca, M.B. Jordan, L. Menk, K. Musick, P. Yeh, A.E. Hollowell, Sandia National Laboratories |
| 9:40am | MN+NS+PS-WeM6 Batch Level Electroless Under Bump Metallization for Singulated Semiconductor Die Matthew Jordan, E. Baca, J. Pillars, C. Michael, A.E. Hollowell, Sandia National Laboratories |
| 11:00am | MN+NS+PS-WeM10 Invited Paper MEMS-based Atomic Force Microscopy Probes: From Electromechanical to Optomechanical Vibrating Sensors Bernard Legrand, LAAS-CNRS, France, L. Schwab, LAAS-CNRS, Univ Tououse, France, P. Allain, I. Favero, MPQ, CNRS, Univ Paris Diderot, France, M. Faucher, D. Théron, IEMN, CNRS, Univ Lille, France, B. Walter, Vmicro SAS, France, J.P. Salvetat, CRPP, CNRS, Univ Bordeaux, France, S. Hentz, G. Jourdan, CEA-LETI, France |
| 11:40am | MN+NS+PS-WeM12 Suppressing Secondary Grain Growth in Sc0.125Al0.875N Using a CMOS Compatible Electrode Giovanni Esteves, M. Berg, M.D. Henry, B.A. Griffin, E.A. Douglas, Sandia National Laboratories |