AVS 65th International Symposium & Exhibition | |
Plasma Science and Technology Division | Tuesday Sessions |
Session PS-TuP |
Session: | Plasma Science and Technology Division Poster Session |
Presenter: | TaeSeung Cho, Applied Materials |
Authors: | T. Cho, Applied Materials S. Park, Applied Materials D. Lubomirsky, Applied Materials |
Correspondent: | Click to Email |
Selective material removal by using remote plasma becomes an indispensable process for 3D structures of semiconductor. In selective material removal process by remote plasma, the wafer process regime is completely isolated from the plasma source by perforated metal plates such as showhead. The radicals generated by electrical discharge pass through the perforated metal plate, while the charged particles cannot pass through. Thus, in the wafer process regime, the specific radicals from the remote plasma react with the target material to be removed from the wafer. Since the charged particles are screened by the plate, the damages by energetic charged particles can be drastically reduced. Therefore, the plasma source for remote plasma removal process should have features of (1) efficient radical generation with higher dissociation rate and (2) less charged particle leakage to wafer process regime.
Magnetic induction plasma concept is being used for lighting bulbs as well as Tokamak fusion reactor for several decades. Especially, the magnetic induction lighting and its driving electronics is being optimized for many years. Since the magnetic induction lighting doesn’t have any electrode inside the bulb there’s no particles from the electrode sputtered by energetic ions. In addition, magnetic induction plasma source as an inductively coupled plasma has higher dissociation rate compared to typical capacitively coupled plasma. Thus, introducing the magnetic induction lighting and its driving technologies to remote plasma removal process would make removal process more efficient and reliable with reduced cost of ownership.
Prototype chamber for magnetic induction plasma source for remote plasma removal process was assembled with standard KF flanges that could be brought off the shelf. To generate stable plasma, we modified the commercial electronic ballast. We introduced initial plasma generation concept to avoid the ignition failure which was one of the most common issue of magnetic induction plasma source. For preliminary study with the electrical and optical diagnostics, Ar+N2 plasma was successfully generated/modulated in the chamber by using the ballast with wide operating pressures from 50mTorr to 200Torr.