Advanced Packaging is critical for the continually evolving demands of IoT. As additional functionality is added to the final product, and as its form factor is reduced to further promote mobility and compatibility, the semiconductor package has become even more critical in the integration and overall success of the technology. Advanced IoT packaging is required to offer not only the reliably and protection required of the technology, but it needs to offer the solution with the lowest possible power usage, most efficient use of space and footprint, improved thermal performance, while at a low cost to the end customer. This presentation will discuss several uses of plasma in advanced packaging solutions to meet these demands in both improving the overall reliability performance as well as offering new technology solutions.