AVS 63rd International Symposium & Exhibition | |
Thin Film | Tuesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
8:00am | TF-TuM1 An Analytic Expression for Reactant Utilization in CVD and ALD Chambers Edward McInerney, Lam Research Corporation |
8:20am | TF-TuM2 Growth of Silicon Films at Room Temperature Using Electron Enhanced Atomic Layer Deposition Jaclyn Sprenger, A.S. Cavanagh, H. Sun, S.M. George, University of Colorado, Boulder |
8:40am | TF-TuM3 Invited Paper Chemical Vapor Deposition within the ALD window – Quantitative Analysis of Precursor Surface Kinetics in Thin Film Formation Michael Reinke, Y. Kuzminykh, P. Hoffmann, Empa, Swiss Federal Laboratories for Materials Science and Technology, Switzerland |
9:20am | TF-TuM5 A Rotation Fluidization Coupled Atomic Layer Deposition Reactor for Nanoparticle Coating C.L. Duan, State Key Laboratory of Digital Manufacturing Equipment and Technology, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, China, R. Chen, State Key Laboratory of Digital Manufacturing Equipment and Technology, School of Mechanical Science and Engineering, School of Optical and Electronic Information, Huazhong University of Science and Technology, China, Kun Cao, Huazhong University of Science and Technology, Wuhan, China |
9:40am | TF-TuM6 Atmospheric Pressure ALD in Porous Substrates: The Effect of Pressure on Step Coverage E. Balder, F. Roozeboom, Paul Poodt, Holst Centre / TNO, Netherlands |
11:00am | TF-TuM10 Invited Paper New Spatial ALD platform for Semiconductor Manufacturing Joseph Yudovsky, Applied Materials, Inc. |
11:40am | TF-TuM12 Spatial MLD of Polyamide Films on Flexible Substrates using a New Rotating Cylinder Reactor in a Custom Oven Daniel Higgs, University of Colorado Boulder, S.M. George, University of Colorado at Boulder |
12:00pm | TF-TuM13 Spatial Atomic Layer Deposition for Porous and Fibrous Materials Gregory Parsons, A.H. Brozena, C.J. Oldham, North Carolina State University |