AVS 63rd International Symposium & Exhibition
    Plasma Science and Technology Wednesday Sessions
       Session PS-WeM

Paper PS-WeM12
Linear Magnetron Magnet Pack for High Power Pulsed Magnetron Sputtering

Wednesday, November 9, 2016, 11:40 am, Room 104B

Session: Plasma Sources and Novel Mechanisms for Generating Plasmas
Presenter: Jake McLain, University of Illinois at Urbana Champaign
Authors: J.T. McLain, University of Illinois at Urbana Champaign
P. Raman, University of Illinois at Urbana Champaign
I.A. Shchelkanov, University of Illinois at Urbana Champaign
J. Hrebik, Kurt J. Lesker Company
B. Jurczyk, Starfire Industries
R. Stubbers, Starfire Industries
D.N. Ruzic, University of Illinois at Urbana-Champaign
Correspondent: Click to Email

High Power Pulsed Magnetron Sputtering (HPPMS) is an ionized physical vapor deposition technique that utilizes high power pulses applied to the sputtering target. The high power densities allow for an increased percentage of sputtered particles to be ions, and the ions allow for more control over the deposition process. The enhanced control allows for improved film quality and surface adhesion when compared with DC magnetron sputtering (DCMS). The primary reason for the lack of industrial implementation is the intrinsically low deposition rate that HPPMS provides. The Center for Plasma-Material Interactions has designed a high deposition rate HPPMS magnet pack that produced comparable deposition rates in HPPMS when compared with a conventional magnet pack using DCMS for a 4-inch circular magnetron with a titanium target at 500W. This magnet pack also increased the HPPMS deposition rate twofold when compared with the conventional magnet pack using HPPMS [1]. To allow for industrial implementation of HPPMS, a similar high deposition rate magnet pack is designed and built for a linear magnetron, capable of being scaled to any desired length. This work focuses on the similarities and differences in the process and physics of the standard and new magnet packs. The properties explored in this work include deposition rate, deposition uniformity, plasma parameters, and film quality.

[1] P. Raman, et al., Surf. Coat. Technol. (2015), http://dx.doi.org/10.1016/j.surfcoat.2015.12.071