| AVS 62nd International Symposium & Exhibition | |
| Electronic Materials and Processing | Wednesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 2:20pm | EM-WeA1 Interdiffusion Characterization of Selective Chemical Vapor Deposition Cobalt Cap and Copper Jeff Shu, Z. Sun, S. Choi, B. Yatzor, Z. Bayindir, G. Zhang, Y. Lee, H. Liu, J. Lansford, GLOBALFOUNDRIES U.S. Inc. |
| 2:40pm | EM-WeA2 Contact Engineering on Carbon Nanotube Interconnect Vias Yusuke Abe, A. Vyas, R. Senegor, C. Yang, Santa Clara University |
| 3:00pm | EM-WeA3 Invited Paper Innovative Technological Solutions for Low-k Integration Beyond 10 nm Mikhail Baklanov, IMEC |
| 4:20pm | EM-WeA7 Invited Paper Challenges and Directions for Dielectric Interconnect Materials for the 10nm node and Beyond Jeffery Bielefeld, J. Blackwell, S. Bojarski, M. Chandhok, J. Clarke, C. Jezewski, N. Kabir, S.W. King, M. Krysak, D.J. Michalak, M. Moinpour, A. Myers, J. Plombon, M. Reshotko, K. Singh, J. Torres, R. Turkot, H. Yoo, Intel Corporation |
| 5:00pm | EM-WeA9 Pore Sealing of Low-k Films by UV Assisted CVD Processes Priyanka Dash, D. Padhi, Applied Materials |
| 5:20pm | EM-WeA10 Copper Deposition and In Situ Chamber Cleaning using Pulsed-CVD Technique Fabien Piallat, J. Vitiello, Altatech, France |
| 5:40pm | EM-WeA11 Study of UV Impact on PECVD Non-Porogen ULK (Ultra low κ) SiCOH Film Nano-Structures, Film Mechanical and Electrical Properties Zhiguo Sun, J. Shu, S. Srivathanakul, H. Liu, GLOBALFOUNDRIES U.S. Inc. |
| 6:00pm | EM-WeA12 Bandgap Narrowing in Low-K Dielectrics Xiangyu Guo, University of Wisconsin-Madison, S.W. King, Intel Corporation, P. Xue, University of Wisconsin-Madison, J.-F. de Marneffe, M. Baklanov, IMEC, Belgium, V. Afanas'ev, Catholic University of Leuven, Belgium, Y. Nishi, Stanford University, J.L. Shohet, University of Wisconsin-Madison |