AVS 60th International Symposium and Exhibition
    Plasma Science and Technology Wednesday Sessions

Session PS-WeM
Fundamentals of Plasma Surface Interactions

Wednesday, October 30, 2013, 8:00 am, Room 104 C
Moderator: S.A. Vitale, MIT Lincoln Laboratory


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  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

8:00am PS-WeM1
Examination of Atomistic Etching Control of SiO2-Si-SiO2 Multi-Layers Stacks Using Cyclic Ar/C4F8 Plasma
D. Metzler, G.S. Oehrlein, University of Maryland, College Park, S.U. Engelmann, R.L. Bruce, E.A. Joseph, IBM T.J. Watson Research Center
8:20am PS-WeM2
Plasma Induced Surface Roughness of ArF Photoresist Examined by Plasma-Beam Processes
T. Takeuchi, Y. Zhang, K. Ishikawa, M. Sekine, Nagoya University, Japan, Y. Setsuhara, Osaka University, Japan, K. Takeda, H. Kondo, M. Hori, Nagoya University, Japan
8:40am PS-WeM3
Sidewall Polymer Deposition for Achieving Near 1:1 x:y Critical Dimension Shrinkage
N.A. Fox-Lyon, D. Metzler, A.J. Knoll, University of Maryland, College Park, T. Lii, D. Farber, Texas Instruments, G.S. Oehrlein, University of Maryland, College Park
9:00am PS-WeM4
Plasma Energy Partitioning and Influences on Surface Reactivity
J.M. Blechle, M.F. Cuddy, E.R. Fisher, Colorado State University
9:20am PS-WeM5
H2/ D2/Ar Plasmas Interacting with Carbon-based Films: Plasma Distribution Functions, Etching and Applications
N.A. Fox-Lyon, A.J. Knoll, University of Maryland, College Park, J. Franek, West Virginia University, V. Demidov, Wright-Patterson Air Force Base, M. Koepke, West Virginia University, G.S. Oehrlein, University of Maryland, College Park
9:40am PS-WeM6
Molecular Dynamics Simulation for Hydrogen Plasma Processing of Graphene
A. Davydova, E. Despiau-Pujo, G. Cunge, Cnrs/ujf/ Cea - Ltm, France, D.B. Graves, University of California, Berkeley, L. Magaud, L. Delfour, CNRS/UJF, Institut Néel, France
10:40am PS-WeM9 Invited Paper
Beam Studies of Plasma Etching Reactions
K. Karahashi, S. Hamaguchi, Osaka University, Japan
11:20am PS-WeM11
Surface Cleaning for Enhanced Adhesion to Packaging Surfaces: Plasma and Free Radical Chemistries
S. Gaddam, H. Kasi, J. Kelber, University of North Texas