| AVS 59th Annual International Symposium and Exhibition | |
| MEMS and NEMS | Tuesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| MN-TuP1 Tangential Momentum Accommodation Coefficients in Coated Microtubes M. Hadj Nacer, I. Graur, P. Perrier, J.G. Méolans, Aix-Marseille Université, Ecole Polytechnique Universitaire de Marseille, France, M. Wüest, INFICON Ltd, Liechtenstein |
| MN-TuP3 Development of Deposition and Etching Processes of Thick ZnS Films for Pixel Level Packaging of Infrared Focal Plane Arrays B. Glück, ST Microelectronics, France, G. Rodriguez, G. Dumont, S. Barnola, CEA, LETI, MINATEC Campus, France |
| MN-TuP4 Low Damage Etching Process for Fabricating Micro Electro Mechanical Systems (MEMS) Devices using Neutral Beam K. Miwa, Y. Nishimori, S. Ueki, BEANS Laboratory, Japan, M. Sugiyama, The University of Tokyo, Japan, T. Kubota, S. Samukawa, Tohoku University, Japan |
| MN-TuP5 Deveropment of Test Instrument for the Mechanical Strength of Micro-nano Wires A. Kasahara, M. Sasaki, H. Suzuki, M. Goto, M. Tosa, National Institute for Materials Science (NIMS), Japan |
| MN-TuP6 Tin-Oxide Nanostructured Arrays Based Integrated MEMS Device for Low Temperature Hydrogen Detection R.N. McCormack, University of Central Florida, N. Shirato, University of Tennessee, U. Singh, S. Das, A. Kumar, H.J. Cho, University of Central Florida, R. Kalyanaraman, University of Tennessee, S.S. Seal, University of Central Florida |
| MN-TuP7 Nanoimprint Block Co-polymer Enhanced Nanostructure Lithography J. Zendejas, B. Wong, S. Franz, R. Candler, UCLA |
| MN-TuP9 Electrostatic Deposition of a Micro Solder Particle Using a Single Probe by Applying a Single Rectangular Pulse D. Nakabayashi, K. Sawai, P. Hemthavy, K. Takahashi, S. Saito, Tokyo Institute of Technology, Japan |